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Effect of deposition temperature and thermal annealing on the dry etch rate of a-C: H films for the dry etch hard process of semiconductor devices

Lee, Seung Moo; Won, Jaihyung; Yim, Soyoung; Park, Se Jun; Choi, Jongsik; Kim, Jeongtae; Lee, Hyeondeok; Byun, Dongjin

ArticleIssue Date2012CitationTHIN SOLID FILMS, v.520, no.16, pp.5284 - 5288PublisherELSEVIER SCIENCE SA
1
STATISTICS
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