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RF device package method using Au to Au direct bonding technology

Kwon, Sangwook; Kim, Jongseok; Park, Gilsu; Hong, Youngtack; Ju, Byeongkwon; Song, Insang

ArticleIssue Date2009CitationMICROELECTRONICS RELIABILITY, v.49, no.1, pp 99 - 102PublisherPERGAMON-ELSEVIER SCIENCE LTD
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