Yoon, Euysik; Lee, Myoungjin; Lee, Seoungnam; Jeong, Chandong; Lee, Jaehoon; Jeong, Jichai
ArticleIssue Date2008CitationIEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.4, pp.824 - 830PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC