Effects of Ni3Sn4 and (Cu,Ni)(6)Sn-5 intermetallic layers on cross-interaction between Pd and Ni in solder joints
DC Field | Value | Language |
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dc.contributor.author | Baek, Yong-Ho | - |
dc.contributor.author | Chung, Bo-Mook | - |
dc.contributor.author | Choi, Young-Sik | - |
dc.contributor.author | Choi, Jaeho | - |
dc.contributor.author | Huh, Joo-Youl | - |
dc.date.accessioned | 2021-09-05T18:00:40Z | - |
dc.date.available | 2021-09-05T18:00:40Z | - |
dc.date.created | 2021-06-15 | - |
dc.date.issued | 2013-12-05 | - |
dc.identifier.issn | 0925-8388 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/101314 | - |
dc.description.abstract | We examined the effects of layers of intermetallic compound (IMC) Ni3Sn4 and (Cu,Ni)(6)Sn-5 formed at the solder/Ni interface, on the cross-interactions between Pd and Ni during solid-state aging and reflow soldering. Two types of diffusion couples, Pd/Sn/Ni and Pd/Sn-Cu/Ni, were aged at 150 degrees C to study the solidstate interactions. In contrast to the Pd/Sn/Ni couples in which a Ni3Sn4 layer formed at the Ni interface, the Pd/Sn-Cu/Ni couple where a (Cu,Ni)(6)Sn-5 layer formed at the Ni interface exhibited no significant interaction between Pd and Ni. The (Cu, Ni)(6)Sn-5 layer acted as an effective barrier against Ni diffusion and thus inhibited the resettlement of (Pd, Ni)Sn-4 onto the Ni interface. For the interaction during reflow, Sn-3.5Ag and Sn-3.0Ag-0.5Cu solder balls were isothermally reflowed on an electroless Ni(P)/electroless Pd/immersion Au (ENEPIG) surface finish at 250 degrees C, and the dissolution kinetics of the (Pd,Ni) Sn-4 particles converted from the 0.2-mu m-thick Pd-finish layer were examined. The spalled (Pd, Ni) Sn4 particles very quickly dissolved into the molten solder when the IMC layer formed on the Ni substrate was (Cu,Ni)(6)Sn-5 rather than Ni3Sn4. The dependence of the dissolution kinetics of the spalled (Pd,Ni) Sn-4 particles on the IMC layers was rationalized on the basis of a Sn-Ni-Pd isotherm at 250 degrees C. The present study suggests that the formation of a dense (Cu,Ni)(6)Sn-5 layer at the solder/Ni interface can effectively alleviate the (Pd,Ni) Sn-4-related degradation of solder joint reliability. (C) 2013 Elsevier B.V. All rights reserved. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | ELSEVIER SCIENCE SA | - |
dc.subject | NI/SN/CU DIFFUSION COUPLES | - |
dc.subject | INTERFACIAL REACTION | - |
dc.subject | CU CONCENTRATION | - |
dc.subject | WIRE BONDS | - |
dc.subject | GROWTH | - |
dc.subject | RELIABILITY | - |
dc.subject | THICKNESS | - |
dc.subject | GOLD | - |
dc.subject | AU | - |
dc.subject | METALLIZATION | - |
dc.title | Effects of Ni3Sn4 and (Cu,Ni)(6)Sn-5 intermetallic layers on cross-interaction between Pd and Ni in solder joints | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Huh, Joo-Youl | - |
dc.identifier.doi | 10.1016/j.jallcom.2013.05.055 | - |
dc.identifier.scopusid | 2-s2.0-84878410693 | - |
dc.identifier.wosid | 000324523500014 | - |
dc.identifier.bibliographicCitation | JOURNAL OF ALLOYS AND COMPOUNDS, v.579, pp.75 - 81 | - |
dc.relation.isPartOf | JOURNAL OF ALLOYS AND COMPOUNDS | - |
dc.citation.title | JOURNAL OF ALLOYS AND COMPOUNDS | - |
dc.citation.volume | 579 | - |
dc.citation.startPage | 75 | - |
dc.citation.endPage | 81 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Chemistry | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Physical | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
dc.subject.keywordPlus | NI/SN/CU DIFFUSION COUPLES | - |
dc.subject.keywordPlus | INTERFACIAL REACTION | - |
dc.subject.keywordPlus | CU CONCENTRATION | - |
dc.subject.keywordPlus | WIRE BONDS | - |
dc.subject.keywordPlus | GROWTH | - |
dc.subject.keywordPlus | RELIABILITY | - |
dc.subject.keywordPlus | THICKNESS | - |
dc.subject.keywordPlus | GOLD | - |
dc.subject.keywordPlus | AU | - |
dc.subject.keywordPlus | METALLIZATION | - |
dc.subject.keywordAuthor | Ni(P)/Pd/Au surface finish | - |
dc.subject.keywordAuthor | Pb-free solder | - |
dc.subject.keywordAuthor | Pd resettlement | - |
dc.subject.keywordAuthor | Cross-interaction | - |
dc.subject.keywordAuthor | Diffusion barrier | - |
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