Cold Spray Deposition of Copper Electrodes on Silicon and Glass Substrates
- Authors
- Kim, Do-Yeon; Park, Jung-Jae; Lee, Jong-Gun; Kim, Donghwan; Tark, Sung Ju; Ahn, Sejin; Yun, Jae Ho; Gwak, Jihye; Yoon, Kyung Hoon; Chandra, Sanjeev; Yoon, Sam S.
- Issue Date
- 10월-2013
- Publisher
- SPRINGER
- Keywords
- coating glass; cold spray; copper electrode; line printing; solar cell
- Citation
- JOURNAL OF THERMAL SPRAY TECHNOLOGY, v.22, no.7, pp.1092 - 1102
- Indexed
- SCIE
SCOPUS
- Journal Title
- JOURNAL OF THERMAL SPRAY TECHNOLOGY
- Volume
- 22
- Number
- 7
- Start Page
- 1092
- End Page
- 1102
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/102103
- DOI
- 10.1007/s11666-013-9953-4
- ISSN
- 1059-9630
- Abstract
- Copper lines with widths varying from 150 to 1500 mu m were deposited onto crystalline silicon wafers and soda-lime glass plates by cold spraying copper particles with 1 mu m average diameter through a mask. This direct deposition method yielded high-aspect-ratio electrodes with minimum shadowing effects and maximum electrode-to-silicon contact area. The copper lines had triangular cross sections with aspect ratios (height/width) ranging from 0.1 to 1.1, depending on the number of spray gun passes. Copper particles were densely packed with increasing the width of the masking slit. This study presents the potential use of the cold spray technology in printing lines as front electrodes in solar cell applications.
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- Appears in
Collections - College of Engineering > Department of Materials Science and Engineering > 1. Journal Articles
- College of Engineering > Department of Mechanical Engineering > 1. Journal Articles
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