Effects of controllable process factors on Al rear surface bumps in Si solar cells
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park, Sungeun | - |
dc.contributor.author | Bae, Soohyun | - |
dc.contributor.author | Kim, Hyunho | - |
dc.contributor.author | Kim, Seongtak | - |
dc.contributor.author | Do Kim, Young | - |
dc.contributor.author | Park, Hyomin | - |
dc.contributor.author | Kim, Soomin | - |
dc.contributor.author | Tark, Sung Ju | - |
dc.contributor.author | Son, Chang-Sik | - |
dc.contributor.author | Kim, Donghwan | - |
dc.date.accessioned | 2021-09-06T23:17:50Z | - |
dc.date.available | 2021-09-06T23:17:50Z | - |
dc.date.created | 2021-06-18 | - |
dc.date.issued | 2012-01 | - |
dc.identifier.issn | 1567-1739 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/109130 | - |
dc.description.abstract | High efficiency solar cells require good back surface field passivation and high back reflectance in the rear Al region. In module processes, wafer-based solar cell can break through stress during soldering uneven rear aluminum surfaces - a serious problem that affects throughput. This work examined rear surfaces with respect to controllable process factors such as ramping and cooling rates during rapid thermal processing, and the fineness of aluminum powder used in the screen-printed paste. A faster ramp up rate resulted in a uniform temperature gradient between the aluminum and silicon surfaces. As a results, the bumps on the aluminum surface were small and of high density. Fine aluminum metal powder in the paste for screen-printing contact points resulted in large distribution, high density bumps. Bumps formed during cooling in metallization, their sizes and densities were dependent the on uniformity of the aluminum and silicon liquid wetting of the silicon surface. (C) 2011 Elsevier B. V. All rights reserved. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | ELSEVIER SCIENCE BV | - |
dc.subject | SILICON | - |
dc.subject | FIELD | - |
dc.title | Effects of controllable process factors on Al rear surface bumps in Si solar cells | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, Donghwan | - |
dc.identifier.doi | 10.1016/j.cap.2011.04.021 | - |
dc.identifier.scopusid | 2-s2.0-80054812324 | - |
dc.identifier.wosid | 000296525700004 | - |
dc.identifier.bibliographicCitation | CURRENT APPLIED PHYSICS, v.12, no.1, pp.17 - 22 | - |
dc.relation.isPartOf | CURRENT APPLIED PHYSICS | - |
dc.citation.title | CURRENT APPLIED PHYSICS | - |
dc.citation.volume | 12 | - |
dc.citation.number | 1 | - |
dc.citation.startPage | 17 | - |
dc.citation.endPage | 22 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.identifier.kciid | ART001629042 | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.description.journalRegisteredClass | kci | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | SILICON | - |
dc.subject.keywordPlus | FIELD | - |
dc.subject.keywordAuthor | Aluminum back surface field | - |
dc.subject.keywordAuthor | Al bump | - |
dc.subject.keywordAuthor | Solar cells | - |
dc.subject.keywordAuthor | Al-Si eutectic alloy | - |
dc.subject.keywordAuthor | Al-Si contact | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
(02841) 서울특별시 성북구 안암로 14502-3290-1114
COPYRIGHT © 2021 Korea University. All Rights Reserved.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.