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Simplified Ground-type Single-plate Electrowetting Device for Droplet Transport

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dc.contributor.authorChang, Jong-Hyeon-
dc.contributor.authorKim, Dong-Sik-
dc.contributor.authorPak, James Jungho-
dc.date.accessioned2021-09-07T12:39:35Z-
dc.date.available2021-09-07T12:39:35Z-
dc.date.created2021-06-14-
dc.date.issued2011-05-
dc.identifier.issn1975-0102-
dc.identifier.urihttps://scholar.korea.ac.kr/handle/2021.sw.korea/112498-
dc.description.abstractThe current paper describes a simpler ground-type, single-plate electrowetting configuration for droplet transport in digital microfluidics without performance degradation. The simplified fabrication process is achieved with two photolithography steps. The first step simultaneously patterns both a control electrode array and a reference electrode on a substrate. The second step patterns a dielectric layer at the top to expose the reference electrode for grounding the liquid droplet. In the experiment, a 5 mu m thick photo-imageable polyimide, with a 3.3 dielectric constant, is used as the dielectric layer. A 10 nm Teflon-AF is coated to obtain a hydrophobic surface with a high water advancing angle of 116 degrees and a small contact angle hysteresis of 5 degrees. The droplet movement of 1 mM methylene blue on this simplified device is successfully demonstrated at control voltages above the required 45 V to overcome the contact angle hysteresis.-
dc.languageEnglish-
dc.language.isoen-
dc.publisherKOREAN INST ELECTR ENG-
dc.subjectACTUATION-
dc.subjectMICROFLUIDICS-
dc.subjectEWOD-
dc.subjectSYSTEM-
dc.subjectWATER-
dc.titleSimplified Ground-type Single-plate Electrowetting Device for Droplet Transport-
dc.typeArticle-
dc.contributor.affiliatedAuthorKim, Dong-Sik-
dc.contributor.affiliatedAuthorPak, James Jungho-
dc.identifier.doi10.5370/JEET.2011.6.3.402-
dc.identifier.scopusid2-s2.0-84863230181-
dc.identifier.wosid000290236900016-
dc.identifier.bibliographicCitationJOURNAL OF ELECTRICAL ENGINEERING & TECHNOLOGY, v.6, no.3, pp.402 - 407-
dc.relation.isPartOfJOURNAL OF ELECTRICAL ENGINEERING & TECHNOLOGY-
dc.citation.titleJOURNAL OF ELECTRICAL ENGINEERING & TECHNOLOGY-
dc.citation.volume6-
dc.citation.number3-
dc.citation.startPage402-
dc.citation.endPage407-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.identifier.kciidART001545804-
dc.description.journalClass1-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.description.journalRegisteredClasskci-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.subject.keywordPlusACTUATION-
dc.subject.keywordPlusMICROFLUIDICS-
dc.subject.keywordPlusEWOD-
dc.subject.keywordPlusSYSTEM-
dc.subject.keywordPlusWATER-
dc.subject.keywordAuthorElectrowetting-
dc.subject.keywordAuthorDigital microfluidics-
dc.subject.keywordAuthorDroplet transport-
dc.subject.keywordAuthorSingle-plate configuration-
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