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Hot embossing for fabrication of a microfluidic 3D cell culture platform

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dc.contributor.authorJeon, Jessie S.-
dc.contributor.authorChung, Seok-
dc.contributor.authorKamm, Roger D.-
dc.contributor.authorCharest, Joseph L.-
dc.date.accessioned2021-09-07T13:31:09Z-
dc.date.available2021-09-07T13:31:09Z-
dc.date.created2021-06-14-
dc.date.issued2011-04-
dc.identifier.issn1387-2176-
dc.identifier.urihttps://scholar.korea.ac.kr/handle/2021.sw.korea/112701-
dc.description.abstractClinically relevant studies of cell function in vitro require a physiologically-representative microenvironment possessing aspects such as a 3D extracellular matrix (ECM) and controlled biochemical and biophysical parameters. A polydimethylsiloxane (PDMS) microfluidic system with a 3D collagen gel has previously served for analysis of factors inducing different responses of cells in a 3D microenvironment under controlled biochemical and biophysical parameters. In the present study, applying the known commercially-viable manufacturing methods to a cyclic olefin copolymer (COC) material resulted in a microfluidic device with enhanced 3D gel capabilities, controlled surface properties, and improved potential to serve high-volume applications. Hot embossing and roller lamination molded and sealed the microfluidic device. A combination of oxygen plasma and thermal treatments enhanced the sealing, ensured proper placement of the 3D gel, and created controlled and stable surface properties within the device. Culture of cells in the new device indicated no adverse effects of the COC material or processing as compared to previous PDMS devices. The results demonstrate a methodology to transition microfludic devices for 3D cell culture from scientific research to high-volume applications with broad clinical impact.-
dc.languageEnglish-
dc.language.isoen-
dc.publisherSPRINGER-
dc.subjectCHEMISTRY-
dc.subjectLITHOGRAPHY-
dc.subjectTOPOGRAPHY-
dc.subjectPATTERNS-
dc.subjectCHIPS-
dc.titleHot embossing for fabrication of a microfluidic 3D cell culture platform-
dc.typeArticle-
dc.contributor.affiliatedAuthorChung, Seok-
dc.identifier.doi10.1007/s10544-010-9496-0-
dc.identifier.scopusid2-s2.0-79958145000-
dc.identifier.wosid000288169000007-
dc.identifier.bibliographicCitationBIOMEDICAL MICRODEVICES, v.13, no.2, pp.325 - 333-
dc.relation.isPartOfBIOMEDICAL MICRODEVICES-
dc.citation.titleBIOMEDICAL MICRODEVICES-
dc.citation.volume13-
dc.citation.number2-
dc.citation.startPage325-
dc.citation.endPage333-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaScience & Technology - Other Topics-
dc.relation.journalWebOfScienceCategoryEngineering, Biomedical-
dc.relation.journalWebOfScienceCategoryNanoscience & Nanotechnology-
dc.subject.keywordPlusCHEMISTRY-
dc.subject.keywordPlusLITHOGRAPHY-
dc.subject.keywordPlusTOPOGRAPHY-
dc.subject.keywordPlusPATTERNS-
dc.subject.keywordPlusCHIPS-
dc.subject.keywordAuthorCOC-
dc.subject.keywordAuthorMicrofluidics-
dc.subject.keywordAuthor3D cell culture-
dc.subject.keywordAuthorHot embossing-
dc.subject.keywordAuthorThermal bonding-
dc.subject.keywordAuthorSurface treatment-
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