A numerical study of the effects of heat transfer and fluid flow on tube insertion length in computer-cooling radiators
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Choi, J.T. | - |
dc.contributor.author | Kwon, O.K. | - |
dc.contributor.author | Yun, J.H. | - |
dc.contributor.author | Kim, Y.C. | - |
dc.date.accessioned | 2021-09-07T20:50:38Z | - |
dc.date.available | 2021-09-07T20:50:38Z | - |
dc.date.created | 2021-06-17 | - |
dc.date.issued | 2011 | - |
dc.identifier.issn | 1226-4881 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/114712 | - |
dc.description.abstract | The performance of flat-tube radiators with lowered fins was numerically investigated for different tube insertion lengths. The results of numerical analysis using CFX-11 were compared with experimental results. In this study, three types of flat-tube radiators with lowered fins were considered An experiment was conducted to validate the numerical results. Flow rate ratio (FR) and Stotai were introduced to understand the uniformity of flow distribution easily. The results of numerical analysis revealed that the heat transfer rate and pressure drop increased as the mass flow rate increased Further, the results showed that the heat transfer rate of sample 3 with h/D = 0.5 was higher than that of the other samples. The pressure drop increased as the insertion length toward the header part increased and the pressure drop in the case of sample 3 appeared to be the highest The factor Stotal showed that the uniformity of the flow distribution in the case of sample 1 with h/D = 0 was higher than that in the case of the other samples. © 2011 The Korean Society of Mechanical Engineers. | - |
dc.language | Korean | - |
dc.language.iso | ko | - |
dc.subject | Cooling radiator | - |
dc.subject | CPU cooling | - |
dc.subject | Electronic device | - |
dc.subject | Flat-Tube | - |
dc.subject | Flow distribution | - |
dc.subject | Flowrate ratio | - |
dc.subject | Heat transfer and fluid flow | - |
dc.subject | Heat transfer rate | - |
dc.subject | Louver-Fin | - |
dc.subject | Mass flow rate | - |
dc.subject | Numerical results | - |
dc.subject | Numerical studies | - |
dc.subject | Cooling | - |
dc.subject | Fins (heat exchange) | - |
dc.subject | Flow of fluids | - |
dc.subject | Forced convection | - |
dc.subject | Heat transfer | - |
dc.subject | Liquids | - |
dc.subject | Numerical analysis | - |
dc.subject | Pressure drop | - |
dc.subject | Radiators | - |
dc.subject | Specific heat | - |
dc.subject | Thermoelectric equipment | - |
dc.subject | Tubes (components) | - |
dc.subject | Electronic cooling | - |
dc.title | A numerical study of the effects of heat transfer and fluid flow on tube insertion length in computer-cooling radiators | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, Y.C. | - |
dc.identifier.doi | 10.3795/KSME-B.2011.35.2.145 | - |
dc.identifier.scopusid | 2-s2.0-79952052723 | - |
dc.identifier.bibliographicCitation | Transactions of the Korean Society of Mechanical Engineers, B, v.35, no.2, pp.145 - 152 | - |
dc.relation.isPartOf | Transactions of the Korean Society of Mechanical Engineers, B | - |
dc.citation.title | Transactions of the Korean Society of Mechanical Engineers, B | - |
dc.citation.volume | 35 | - |
dc.citation.number | 2 | - |
dc.citation.startPage | 145 | - |
dc.citation.endPage | 152 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.identifier.kciid | ART001522013 | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scopus | - |
dc.description.journalRegisteredClass | kci | - |
dc.subject.keywordPlus | Cooling radiator | - |
dc.subject.keywordPlus | CPU cooling | - |
dc.subject.keywordPlus | Electronic device | - |
dc.subject.keywordPlus | Flat-Tube | - |
dc.subject.keywordPlus | Flow distribution | - |
dc.subject.keywordPlus | Flowrate ratio | - |
dc.subject.keywordPlus | Heat transfer and fluid flow | - |
dc.subject.keywordPlus | Heat transfer rate | - |
dc.subject.keywordPlus | Louver-Fin | - |
dc.subject.keywordPlus | Mass flow rate | - |
dc.subject.keywordPlus | Numerical results | - |
dc.subject.keywordPlus | Numerical studies | - |
dc.subject.keywordPlus | Cooling | - |
dc.subject.keywordPlus | Fins (heat exchange) | - |
dc.subject.keywordPlus | Flow of fluids | - |
dc.subject.keywordPlus | Forced convection | - |
dc.subject.keywordPlus | Heat transfer | - |
dc.subject.keywordPlus | Liquids | - |
dc.subject.keywordPlus | Numerical analysis | - |
dc.subject.keywordPlus | Pressure drop | - |
dc.subject.keywordPlus | Radiators | - |
dc.subject.keywordPlus | Specific heat | - |
dc.subject.keywordPlus | Thermoelectric equipment | - |
dc.subject.keywordPlus | Tubes (components) | - |
dc.subject.keywordPlus | Electronic cooling | - |
dc.subject.keywordAuthor | Cpu cooling | - |
dc.subject.keywordAuthor | Electronic devices | - |
dc.subject.keywordAuthor | Flat-Tube | - |
dc.subject.keywordAuthor | Liquid-Cooling | - |
dc.subject.keywordAuthor | Louver-Fin | - |
dc.subject.keywordAuthor | Radiator | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
(02841) 서울특별시 성북구 안암로 14502-3290-1114
COPYRIGHT © 2021 Korea University. All Rights Reserved.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.