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A numerical study of the effects of heat transfer and fluid flow on tube insertion length in computer-cooling radiators

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dc.contributor.authorChoi, J.T.-
dc.contributor.authorKwon, O.K.-
dc.contributor.authorYun, J.H.-
dc.contributor.authorKim, Y.C.-
dc.date.accessioned2021-09-07T20:50:38Z-
dc.date.available2021-09-07T20:50:38Z-
dc.date.created2021-06-17-
dc.date.issued2011-
dc.identifier.issn1226-4881-
dc.identifier.urihttps://scholar.korea.ac.kr/handle/2021.sw.korea/114712-
dc.description.abstractThe performance of flat-tube radiators with lowered fins was numerically investigated for different tube insertion lengths. The results of numerical analysis using CFX-11 were compared with experimental results. In this study, three types of flat-tube radiators with lowered fins were considered An experiment was conducted to validate the numerical results. Flow rate ratio (FR) and Stotai were introduced to understand the uniformity of flow distribution easily. The results of numerical analysis revealed that the heat transfer rate and pressure drop increased as the mass flow rate increased Further, the results showed that the heat transfer rate of sample 3 with h/D = 0.5 was higher than that of the other samples. The pressure drop increased as the insertion length toward the header part increased and the pressure drop in the case of sample 3 appeared to be the highest The factor Stotal showed that the uniformity of the flow distribution in the case of sample 1 with h/D = 0 was higher than that in the case of the other samples. © 2011 The Korean Society of Mechanical Engineers.-
dc.languageKorean-
dc.language.isoko-
dc.subjectCooling radiator-
dc.subjectCPU cooling-
dc.subjectElectronic device-
dc.subjectFlat-Tube-
dc.subjectFlow distribution-
dc.subjectFlowrate ratio-
dc.subjectHeat transfer and fluid flow-
dc.subjectHeat transfer rate-
dc.subjectLouver-Fin-
dc.subjectMass flow rate-
dc.subjectNumerical results-
dc.subjectNumerical studies-
dc.subjectCooling-
dc.subjectFins (heat exchange)-
dc.subjectFlow of fluids-
dc.subjectForced convection-
dc.subjectHeat transfer-
dc.subjectLiquids-
dc.subjectNumerical analysis-
dc.subjectPressure drop-
dc.subjectRadiators-
dc.subjectSpecific heat-
dc.subjectThermoelectric equipment-
dc.subjectTubes (components)-
dc.subjectElectronic cooling-
dc.titleA numerical study of the effects of heat transfer and fluid flow on tube insertion length in computer-cooling radiators-
dc.typeArticle-
dc.contributor.affiliatedAuthorKim, Y.C.-
dc.identifier.doi10.3795/KSME-B.2011.35.2.145-
dc.identifier.scopusid2-s2.0-79952052723-
dc.identifier.bibliographicCitationTransactions of the Korean Society of Mechanical Engineers, B, v.35, no.2, pp.145 - 152-
dc.relation.isPartOfTransactions of the Korean Society of Mechanical Engineers, B-
dc.citation.titleTransactions of the Korean Society of Mechanical Engineers, B-
dc.citation.volume35-
dc.citation.number2-
dc.citation.startPage145-
dc.citation.endPage152-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.identifier.kciidART001522013-
dc.description.journalClass1-
dc.description.journalRegisteredClassscopus-
dc.description.journalRegisteredClasskci-
dc.subject.keywordPlusCooling radiator-
dc.subject.keywordPlusCPU cooling-
dc.subject.keywordPlusElectronic device-
dc.subject.keywordPlusFlat-Tube-
dc.subject.keywordPlusFlow distribution-
dc.subject.keywordPlusFlowrate ratio-
dc.subject.keywordPlusHeat transfer and fluid flow-
dc.subject.keywordPlusHeat transfer rate-
dc.subject.keywordPlusLouver-Fin-
dc.subject.keywordPlusMass flow rate-
dc.subject.keywordPlusNumerical results-
dc.subject.keywordPlusNumerical studies-
dc.subject.keywordPlusCooling-
dc.subject.keywordPlusFins (heat exchange)-
dc.subject.keywordPlusFlow of fluids-
dc.subject.keywordPlusForced convection-
dc.subject.keywordPlusHeat transfer-
dc.subject.keywordPlusLiquids-
dc.subject.keywordPlusNumerical analysis-
dc.subject.keywordPlusPressure drop-
dc.subject.keywordPlusRadiators-
dc.subject.keywordPlusSpecific heat-
dc.subject.keywordPlusThermoelectric equipment-
dc.subject.keywordPlusTubes (components)-
dc.subject.keywordPlusElectronic cooling-
dc.subject.keywordAuthorCpu cooling-
dc.subject.keywordAuthorElectronic devices-
dc.subject.keywordAuthorFlat-Tube-
dc.subject.keywordAuthorLiquid-Cooling-
dc.subject.keywordAuthorLouver-Fin-
dc.subject.keywordAuthorRadiator-
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