Preparation and Thermal Analysis of Sn-Ag Nano Solders
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Bao, Tran Thai | - |
dc.contributor.author | Kim, Yunkyum | - |
dc.contributor.author | Lee, Joonho | - |
dc.contributor.author | Lee, Jung-Goo | - |
dc.date.accessioned | 2021-09-07T22:28:57Z | - |
dc.date.available | 2021-09-07T22:28:57Z | - |
dc.date.created | 2021-06-14 | - |
dc.date.issued | 2010-12 | - |
dc.identifier.issn | 1345-9678 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/115212 | - |
dc.description.abstract | In this study, Sn-Ag nano solders of three different compositions (Sn-1.0 mass%Ag, Sn-3.5 mass%Ag and Sn-6.5 mass%Ag) were synthesized via arc-discharge process. The properties of Sn-Ag nano solders were analyzed using X-ray Diffraction (XRD), Transmission Electron Microscopy (TEM), Scanning Electron Microscopy (SEM), Energy Dispersive X-ray spectroscopy (EDX), and Differential Scanning Calorimetry (DSC). Particle size relatively widely ranged from 10 nm to 340 nm. For Sn-1.0 mass%Ag and Sn-3.5 mass%Ag, average size was 200 similar to 240 nm, and that for Sn-6.5 mass%Ag was 40 similar to 50 nm with some extra-ordinary large particles of similar to 100 nm. The melting points of the prepared SnAg nano solders were examined with DSC at different heating rates 1K, 3 K and 5 K/min. The congruent melting point of Sn-Ag nano solders was found to be 487 K. [doi:10.2320/matertrans.MJ201013] | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | JAPAN INST METALS | - |
dc.subject | PHASE-DIAGRAM | - |
dc.subject | ARC-DISCHARGE | - |
dc.subject | NANOPARTICLES | - |
dc.subject | PARTICLES | - |
dc.subject | ALLOYS | - |
dc.subject | CU | - |
dc.title | Preparation and Thermal Analysis of Sn-Ag Nano Solders | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Lee, Joonho | - |
dc.identifier.doi | 10.2320/matertrans.MJ201013 | - |
dc.identifier.scopusid | 2-s2.0-79551665236 | - |
dc.identifier.wosid | 000287390300003 | - |
dc.identifier.bibliographicCitation | MATERIALS TRANSACTIONS, v.51, no.12, pp.2145 - 2149 | - |
dc.relation.isPartOf | MATERIALS TRANSACTIONS | - |
dc.citation.title | MATERIALS TRANSACTIONS | - |
dc.citation.volume | 51 | - |
dc.citation.number | 12 | - |
dc.citation.startPage | 2145 | - |
dc.citation.endPage | 2149 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
dc.subject.keywordPlus | PHASE-DIAGRAM | - |
dc.subject.keywordPlus | ARC-DISCHARGE | - |
dc.subject.keywordPlus | NANOPARTICLES | - |
dc.subject.keywordPlus | PARTICLES | - |
dc.subject.keywordPlus | ALLOYS | - |
dc.subject.keywordPlus | CU | - |
dc.subject.keywordAuthor | arc discharge process | - |
dc.subject.keywordAuthor | differential scanning calorimeny | - |
dc.subject.keywordAuthor | nano solder | - |
dc.subject.keywordAuthor | phase diagram | - |
dc.subject.keywordAuthor | tin-silver alloy | - |
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