LCD패널 압착장비의 고온압착성능 개선에 관한 연구
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 황일권 | - |
dc.contributor.author | 김동민 | - |
dc.contributor.author | 채수원 | - |
dc.date.accessioned | 2021-09-08T06:47:24Z | - |
dc.date.available | 2021-09-08T06:47:24Z | - |
dc.date.created | 2021-06-17 | - |
dc.date.issued | 2010 | - |
dc.identifier.issn | 1225-9071 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/117472 | - |
dc.description.abstract | The bonding process of LCD panel is attaching an inner lead to an outer lead in the production line of LCD panel module. It is composed of an OLB process and a PCB bonding process. Since bonding tool assembly is one of the core parts of the bonding equipment that determines the durability and performance of the final product, much design efforts to enhance uniformity and efficiency of the process have been made. In this paper, FE analyses have been employed to determine the bonding tool size. Bonding tool of long bar shape has been simplified as a piece with same heater pitch, and appropriate boundary conditions such as convection and radiation are considered. Thermal analysis results by the FEM have been validated by the experiments. With the use of FE analysis varies design parameters and the corresponding effects have been evaluated. It was observed that the approach presented in this paper could be employed for the design of LCD module bonding tool. | - |
dc.language | Korean | - |
dc.language.iso | ko | - |
dc.publisher | 한국정밀공학회 | - |
dc.title | LCD패널 압착장비의 고온압착성능 개선에 관한 연구 | - |
dc.title.alternative | A Study on the Improvement of High Temperature Bonding Performance of LCD Panel Bonding Equipment | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | 채수원 | - |
dc.identifier.bibliographicCitation | 한국정밀공학회지, v.27, no.12, pp.84 - 91 | - |
dc.relation.isPartOf | 한국정밀공학회지 | - |
dc.citation.title | 한국정밀공학회지 | - |
dc.citation.volume | 27 | - |
dc.citation.number | 12 | - |
dc.citation.startPage | 84 | - |
dc.citation.endPage | 91 | - |
dc.type.rims | ART | - |
dc.identifier.kciid | ART001495017 | - |
dc.description.journalClass | 2 | - |
dc.description.journalRegisteredClass | kci | - |
dc.subject.keywordAuthor | OLB (패널 외부단자 접합) | - |
dc.subject.keywordAuthor | PCB Bonding (PCB 접합) | - |
dc.subject.keywordAuthor | LCD Panel (LCD판넬) | - |
dc.subject.keywordAuthor | Press Bonding Tool (압착 공구) | - |
dc.subject.keywordAuthor | FE Analysis (유한요소해석) | - |
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