Characterization of etch resistance property of imprinting resin

Abstract

Nanoimprint lithography has been intensively researched since it can fabricate nano-scale patterns on large area substrates. Thermal nanoimprinting, using a monomer-based resist has gained more interest due to its shorter process time and lower process temperature, compared to the conventional hot embossing process. A near-zero residual layer imprint process can also be done using monomer-based imprint resin, due to its low viscosity. However, the poor etch resistance of monomer-based imprint resin limits its possible applications. In this study, Methacryloxypropyl terminated Poly-Dimethylsiloxanes material was added to a monomer-based thermal imprint resin, and its effect on etch resistance and imprintability was investigated.