Adopting the banked register file scheme for better performance and less leakage
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jang, Hyung Beom | - |
dc.contributor.author | Chung, Eui-Young | - |
dc.contributor.author | Chung, Sung Woo | - |
dc.date.accessioned | 2021-09-09T05:48:14Z | - |
dc.date.available | 2021-09-09T05:48:14Z | - |
dc.date.created | 2021-06-10 | - |
dc.date.issued | 2008-08 | - |
dc.identifier.issn | 1225-6463 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/122979 | - |
dc.description.abstract | Excessively high temperature deteriorates the reliability and increases the leakage power consumption of microprocessors. The register file, known as one of the hottest functional units in microprocessors, incurs frequent dynamic thermal management operations for thermal control. In this letter we adopt the banked register file scheme, which was originally proposed to reduce dynamic power consumption. By simply modifying the register file structure, the temperature in the register file was reduced dramatically, resulting in 13.37% performance improvement and 10.49% total processor leakage reduction. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | WILEY | - |
dc.title | Adopting the banked register file scheme for better performance and less leakage | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Chung, Sung Woo | - |
dc.identifier.doi | 10.4218/etrij.08.0208.0052 | - |
dc.identifier.scopusid | 2-s2.0-49449107181 | - |
dc.identifier.wosid | 000258418400020 | - |
dc.identifier.bibliographicCitation | ETRI JOURNAL, v.30, no.4, pp.624 - 626 | - |
dc.relation.isPartOf | ETRI JOURNAL | - |
dc.citation.title | ETRI JOURNAL | - |
dc.citation.volume | 30 | - |
dc.citation.number | 4 | - |
dc.citation.startPage | 624 | - |
dc.citation.endPage | 626 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.identifier.kciid | ART001269306 | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.description.journalRegisteredClass | kci | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Telecommunications | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Telecommunications | - |
dc.subject.keywordAuthor | microprocessor | - |
dc.subject.keywordAuthor | banked register file | - |
dc.subject.keywordAuthor | DTM | - |
dc.subject.keywordAuthor | dynamic thermal management | - |
dc.subject.keywordAuthor | leakage | - |
dc.subject.keywordAuthor | computer architecture | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
(02841) 서울특별시 성북구 안암로 14502-3290-1114
COPYRIGHT © 2021 Korea University. All Rights Reserved.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.