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A structural and compositional analysis of a TiOx diffusion barrier for indium tin oxide/Si contacts

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dc.contributor.authorOk, Young-Woo-
dc.contributor.authorPark, Won-Kyu-
dc.contributor.authorKim, Hyun-Mi-
dc.contributor.authorKim, Ki-Bum-
dc.contributor.authorKim, Donghwan-
dc.date.accessioned2021-09-09T05:50:00Z-
dc.date.available2021-09-09T05:50:00Z-
dc.date.created2021-06-10-
dc.date.issued2008-08-
dc.identifier.issn1598-9623-
dc.identifier.urihttps://scholar.korea.ac.kr/handle/2021.sw.korea/122989-
dc.description.abstractWe investigated the structural and compositional changes of titanium oxides as a diffusion barrier between indium tin oxide (ITO) and Si under two different Ti oxidation conditions: (1) annealing of the Ti layer deposited on Si in air followed by ITO deposition (Type I) and (2) annealing in nitrogen after the deposition of ITO/Ti on Si (Type II). The diffusion barrier layer in both samples, namely the Ti layer oxidized under different conditions, consisted of two regions: a region composed of a mixture of silicide and titanium oxide near the Si substrate and a titanium oxide region near the ITO layer. However, the titanium oxide in the Type I samples was composed of TiO2 and Ti2O3 phases, whereas Ti2O3 was dominant in the Type II samples. In addition, the Type I and II samples showed the formation of voids in the middle of the barrier layer and in the region near the ITO layer, respectively. Therefore, the electrical and optical properties of ITO/TiOx/Si are dependent on the structural and compositional changes of the diffusion barrier layer.-
dc.languageEnglish-
dc.language.isoen-
dc.publisherKOREAN INST METALS MATERIALS-
dc.subjectITO-
dc.subjectFILM-
dc.subjectSI-
dc.subjectCONDUCTIVITY-
dc.titleA structural and compositional analysis of a TiOx diffusion barrier for indium tin oxide/Si contacts-
dc.typeArticle-
dc.contributor.affiliatedAuthorKim, Donghwan-
dc.identifier.doi10.3365/met.mat.2008.08.481-
dc.identifier.scopusid2-s2.0-51349168148-
dc.identifier.wosid000258962400015-
dc.identifier.bibliographicCitationMETALS AND MATERIALS INTERNATIONAL, v.14, no.4, pp.481 - 485-
dc.relation.isPartOfMETALS AND MATERIALS INTERNATIONAL-
dc.citation.titleMETALS AND MATERIALS INTERNATIONAL-
dc.citation.volume14-
dc.citation.number4-
dc.citation.startPage481-
dc.citation.endPage485-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.identifier.kciidART001277203-
dc.description.journalClass1-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.description.journalRegisteredClasskci-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaMetallurgy & Metallurgical Engineering-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryMetallurgy & Metallurgical Engineering-
dc.subject.keywordPlusITO-
dc.subject.keywordPlusFILM-
dc.subject.keywordPlusSI-
dc.subject.keywordPlusCONDUCTIVITY-
dc.subject.keywordAuthorITO/Si reaction-
dc.subject.keywordAuthordiffusion barrier-
dc.subject.keywordAuthorTi oxide-
dc.subject.keywordAuthorinterfacial reaction-
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