A structural and compositional analysis of a TiOx diffusion barrier for indium tin oxide/Si contacts
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Ok, Young-Woo | - |
dc.contributor.author | Park, Won-Kyu | - |
dc.contributor.author | Kim, Hyun-Mi | - |
dc.contributor.author | Kim, Ki-Bum | - |
dc.contributor.author | Kim, Donghwan | - |
dc.date.accessioned | 2021-09-09T05:50:00Z | - |
dc.date.available | 2021-09-09T05:50:00Z | - |
dc.date.created | 2021-06-10 | - |
dc.date.issued | 2008-08 | - |
dc.identifier.issn | 1598-9623 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/122989 | - |
dc.description.abstract | We investigated the structural and compositional changes of titanium oxides as a diffusion barrier between indium tin oxide (ITO) and Si under two different Ti oxidation conditions: (1) annealing of the Ti layer deposited on Si in air followed by ITO deposition (Type I) and (2) annealing in nitrogen after the deposition of ITO/Ti on Si (Type II). The diffusion barrier layer in both samples, namely the Ti layer oxidized under different conditions, consisted of two regions: a region composed of a mixture of silicide and titanium oxide near the Si substrate and a titanium oxide region near the ITO layer. However, the titanium oxide in the Type I samples was composed of TiO2 and Ti2O3 phases, whereas Ti2O3 was dominant in the Type II samples. In addition, the Type I and II samples showed the formation of voids in the middle of the barrier layer and in the region near the ITO layer, respectively. Therefore, the electrical and optical properties of ITO/TiOx/Si are dependent on the structural and compositional changes of the diffusion barrier layer. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | KOREAN INST METALS MATERIALS | - |
dc.subject | ITO | - |
dc.subject | FILM | - |
dc.subject | SI | - |
dc.subject | CONDUCTIVITY | - |
dc.title | A structural and compositional analysis of a TiOx diffusion barrier for indium tin oxide/Si contacts | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, Donghwan | - |
dc.identifier.doi | 10.3365/met.mat.2008.08.481 | - |
dc.identifier.scopusid | 2-s2.0-51349168148 | - |
dc.identifier.wosid | 000258962400015 | - |
dc.identifier.bibliographicCitation | METALS AND MATERIALS INTERNATIONAL, v.14, no.4, pp.481 - 485 | - |
dc.relation.isPartOf | METALS AND MATERIALS INTERNATIONAL | - |
dc.citation.title | METALS AND MATERIALS INTERNATIONAL | - |
dc.citation.volume | 14 | - |
dc.citation.number | 4 | - |
dc.citation.startPage | 481 | - |
dc.citation.endPage | 485 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.identifier.kciid | ART001277203 | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.description.journalRegisteredClass | kci | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
dc.subject.keywordPlus | ITO | - |
dc.subject.keywordPlus | FILM | - |
dc.subject.keywordPlus | SI | - |
dc.subject.keywordPlus | CONDUCTIVITY | - |
dc.subject.keywordAuthor | ITO/Si reaction | - |
dc.subject.keywordAuthor | diffusion barrier | - |
dc.subject.keywordAuthor | Ti oxide | - |
dc.subject.keywordAuthor | interfacial reaction | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
(02841) 서울특별시 성북구 안암로 14502-3290-1114
COPYRIGHT © 2021 Korea University. All Rights Reserved.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.