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W-Band Waveguide Module Design for Power Combining of Linear Microstrip Array

Authors
Yi, C.Kim, K.Kim, H. J.Kim, M.
Issue Date
6월-2021
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Keywords
Millimeter wave (mm-Wave) power amplifiers; spatial power combining; waveguide module
Citation
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.31, no.6, pp.569 - 571
Indexed
SCIE
SCOPUS
Journal Title
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS
Volume
31
Number
6
Start Page
569
End Page
571
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/127891
DOI
10.1109/LMWC.2021.3075243
ISSN
1531-1309
Abstract
A W-band metallic waveguide module capable of spatial power combining of linear microstrip array is presented. The module employs two uniquely devised split-channel blocks to obtain a uniform field distribution in an oversize merged channel and couple an equal amount of power to ten microstrip elements aligned in the direction of the waveguide F-plane. The array of microstrip thru lines, each with a pair of bonding wires, is fabricated on a single dielectric substrate. The measurements indicate that the merged-channel power-combining scheme is properly operating as the two modules separately built to house single and array elements show similar frequency response with fiat insertion losses of 2-3 dB between 90 and 98 GHz.
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