Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Son, Junhyuk | - |
dc.contributor.author | Yu, Dong-Yurl | - |
dc.contributor.author | Kim, Min-Su | - |
dc.contributor.author | Ko, Yong-Ho | - |
dc.contributor.author | Byun, Dong-Jin | - |
dc.contributor.author | Bang, Junghwan | - |
dc.date.accessioned | 2021-12-04T04:41:42Z | - |
dc.date.available | 2021-12-04T04:41:42Z | - |
dc.date.created | 2021-08-30 | - |
dc.date.issued | 2021-02 | - |
dc.identifier.issn | 2075-4701 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/129287 | - |
dc.description.abstract | The nucleation kinetics and morphology of Cu6Sn5 IMCs at the interface between a Sn-0.7Cu-0.2Cr solder and Cu substrate were investigated in this study. A Sn-0.7Cu solder was utilized as a reference to elucidate the impact of Cr addition. The mechanical properties of the solder joints were determined via ball-shear tests. Cu coupons were dipped in the molten solders for 1 and 3 s at 240-300 degrees C, and the morphological analyses were conducted via electron microscopy. Both the solders contained scallop-like Cu6Sn5 IMCs. The smallest Cu6Sn5 IMCs were observed at 260 degrees C in both the solders, and the particle size increased at 280 and 300 degrees C. The IMCs in the Sn-0.7Cu-0.2Cr solder were smaller and thinner than those in the Sn-0.7Cu solder at all the reaction temperatures. The thickness of the IMCs increased as the reaction temperature increased. Inverse C-type nucleation curves were obtained, and the maximum nucleation rate was observed at an intermediate temperature. The shear strengths of the Sn-0.7Cu-0.2Cr solder joints were higher than those of the Sn-0.7Cu solder joints. This study will facilitate the application of lead-free solders, such as Sn-0.7Cu-0.2Cr, in automotive electrical components. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | MDPI | - |
dc.title | Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Byun, Dong-Jin | - |
dc.identifier.doi | 10.3390/met11020210 | - |
dc.identifier.scopusid | 2-s2.0-85099964311 | - |
dc.identifier.wosid | 000622785100001 | - |
dc.identifier.bibliographicCitation | METALS, v.11, no.2, pp.1 - 12 | - |
dc.relation.isPartOf | METALS | - |
dc.citation.title | METALS | - |
dc.citation.volume | 11 | - |
dc.citation.number | 2 | - |
dc.citation.startPage | 1 | - |
dc.citation.endPage | 12 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
dc.subject.keywordAuthor | lead-free solder | - |
dc.subject.keywordAuthor | intermetallic compound | - |
dc.subject.keywordAuthor | dipping test | - |
dc.subject.keywordAuthor | shear strength | - |
dc.subject.keywordAuthor | nucleation kinetics | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
(02841) 서울특별시 성북구 안암로 14502-3290-1114
COPYRIGHT © 2021 Korea University. All Rights Reserved.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.