Thermal and Thermoelectric Properties of SAM-Based Molecular Junctions
DC Field | Value | Language |
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dc.contributor.author | Park, Sohyun | - |
dc.contributor.author | Yoon, Hyo Jae | - |
dc.date.accessioned | 2022-02-15T01:41:30Z | - |
dc.date.available | 2022-02-15T01:41:30Z | - |
dc.date.created | 2022-01-19 | - |
dc.date.issued | 2022-05 | - |
dc.identifier.issn | 1944-8244 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/135805 | - |
dc.description.abstract | In molecular thermoelectrics, the thermopower of molecular junctions is closely interlinked with their thermal properties; however, the detailed relationship between them remains uncertain. This study systematically investigates the thermal properties of self-assembled monolayer (SAM)-based molecular junctions and relates them to the thermoelectric performance of the junctions. The electrode temperatures for the bare Au-TS, Au-TS/EGaIn, and Au-TS/TPT SAM//Ga2O3/EGaIn samples placed on a hot chuck were measured under different conditions, such as air vs vacuum and the presence and absence of thermal grease, which generates a heat conduction channel from a hot chuck to gold. It was revealed that the SAM was the most efficient thermal resistor, which was responsible for the creation of a temperature differential (Delta T) across the junction; Delta T in an air atmosphere is overestimated to some extent, and air mainly contributes to large dispersions of thermovoltage (Delta V) data. While junction measurements in air were possible at low Delta T (up to 13 K), the new optimal condition, under a vacuum and with thermal grease, allowed us to examine a wide temperature range up to Delta T = 40 K and obtain a more reliable Seebeck coefficient (S, mu V/K). The value of S under the new condition was similar to 1.4 times higher than that measured in air without thermal grease. Our study shows the potential of liquid-metal-based junctions to reliably investigate heat conduction across nanometer-thick organic films and elaborates on how the thermal properties of molecular junctions affect their thermoelectric performance. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | AMER CHEMICAL SOC | - |
dc.subject | TRANSPORT | - |
dc.subject | LENGTH | - |
dc.subject | METAL | - |
dc.subject | SINGLE | - |
dc.subject | CONDUCTANCE | - |
dc.subject | RESISTANCE | - |
dc.subject | CHEMISTRY | - |
dc.subject | CONTACT | - |
dc.title | Thermal and Thermoelectric Properties of SAM-Based Molecular Junctions | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Yoon, Hyo Jae | - |
dc.identifier.doi | 10.1021/acsami.1c20840 | - |
dc.identifier.scopusid | 2-s2.0-85122566028 | - |
dc.identifier.wosid | 000737953800001 | - |
dc.identifier.bibliographicCitation | ACS APPLIED MATERIALS & INTERFACES, v.14, no.20, pp.22818 - 22825 | - |
dc.relation.isPartOf | ACS APPLIED MATERIALS & INTERFACES | - |
dc.citation.title | ACS APPLIED MATERIALS & INTERFACES | - |
dc.citation.volume | 14 | - |
dc.citation.number | 20 | - |
dc.citation.startPage | 22818 | - |
dc.citation.endPage | 22825 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.subject.keywordPlus | TRANSPORT | - |
dc.subject.keywordPlus | LENGTH | - |
dc.subject.keywordPlus | METAL | - |
dc.subject.keywordPlus | SINGLE | - |
dc.subject.keywordPlus | CONDUCTANCE | - |
dc.subject.keywordPlus | RESISTANCE | - |
dc.subject.keywordPlus | CHEMISTRY | - |
dc.subject.keywordPlus | CONTACT | - |
dc.subject.keywordAuthor | thermoelectrics | - |
dc.subject.keywordAuthor | liquid metal | - |
dc.subject.keywordAuthor | molecular junctions | - |
dc.subject.keywordAuthor | thermal conduction | - |
dc.subject.keywordAuthor | self-assembled monolayer (SAM) | - |
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