Analysis of device performance and thin-film properties of thermally damaged organic light-emitting diodes

Abstract

This paper reports the variation in the optical and geometrical properties of individual organic layers to be used for thermally damaged top-emission organic light-emitting diodes (TEOLEDs). The copper deposited on the back of TEOLEDs is employed as a thermal facilitator, and a certain thermal damage occurs to the organic layers and devices. The phosphorescent host material 4,4′-bis(N-carbazolyl)-1,1′-biphenyl (CBP) is rapidly damaged to a significant extent owing to the low glass transition temperature (Tg), which also changes its optical and geometrical surface properties. Although the optical properties of the hole transport layer, N,N′-di(1-naphthyl)-N,N′-diphenyl-(1,1′-biphenyl)-4,4′-diamine (NPB) were changed slightly, the surface morphology was changed significantly. Despite having a higher Tg, the exciton blocking layer, tris(4-carbazoyl-9-ylphenyl)amine (TCTA), shows notable variations in optical properties and surface morphology due to heat exposure. Surprisingly, the electroluminescence spectra and micro-cavity are affected by increasing temperature without any considerable changes in device performance. Hence, this study reveals that besides Tg, the surface morphologies and thicknesses of the organic layers are also important factors in the annealing process and play a vital role in causing thermal damage to TEOLEDs. © 2021 Elsevier B.V.