Mixup-based classification of mixed-type defect patterns in wafer bin maps
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Shin, Wooksoo | - |
dc.contributor.author | Kahng, Hyungu | - |
dc.contributor.author | Kim, Seoung Bum | - |
dc.date.accessioned | 2022-06-09T15:41:03Z | - |
dc.date.available | 2022-06-09T15:41:03Z | - |
dc.date.created | 2022-06-09 | - |
dc.date.issued | 2022-05 | - |
dc.identifier.issn | 0360-8352 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/141749 | - |
dc.description.abstract | Wafer bin maps (WBMs) that exhibit systematic defect patterns provide clues for identification of critical failures that occur during the wafer fabrication process. Proper identification of WBMs with specific defect patterns is tied closely to yield improvement in semiconductor manufacturing. Although the latest trend in training neural networks for single defect patterns has made significant progress, identification of WBMs with mixed-type defect patterns has received little attention possibly because of insufficient labeled data with multiple defects which are necessary for model training. To this end, we propose a method to use WBM data with only a single defect for training convolutional neural networks (CNNs) to classify mixed-type defects. Unlike previous methods that focus on synthesizing mixed-type defects prior to model training, our proposed method generates mixed-type defect patterns on the fly for model training by adopting Mixup, a popular neural network regularization strategy. Our method improves performance on WBM classification tasks with two defect types by 19.4 %p and three defect types by 22.1 %p, compared to previous baselines. Experiments were conducted on a real-world WBM benchmark, WM-811 k, to demonstrate the effectiveness and applicability of the proposed method. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | - |
dc.subject | INSPECTION | - |
dc.title | Mixup-based classification of mixed-type defect patterns in wafer bin maps | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, Seoung Bum | - |
dc.identifier.doi | 10.1016/j.cie.2022.107996 | - |
dc.identifier.scopusid | 2-s2.0-85124221841 | - |
dc.identifier.wosid | 000772079700008 | - |
dc.identifier.bibliographicCitation | COMPUTERS & INDUSTRIAL ENGINEERING, v.167 | - |
dc.relation.isPartOf | COMPUTERS & INDUSTRIAL ENGINEERING | - |
dc.citation.title | COMPUTERS & INDUSTRIAL ENGINEERING | - |
dc.citation.volume | 167 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Computer Science | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalWebOfScienceCategory | Computer Science, Interdisciplinary Applications | - |
dc.relation.journalWebOfScienceCategory | Engineering, Industrial | - |
dc.subject.keywordPlus | INSPECTION | - |
dc.subject.keywordAuthor | Wafer bin maps | - |
dc.subject.keywordAuthor | Mixed-type defect patterns | - |
dc.subject.keywordAuthor | Convolutional neural networks | - |
dc.subject.keywordAuthor | Mixup | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
(02841) 서울특별시 성북구 안암로 14502-3290-1114
COPYRIGHT © 2021 Korea University. All Rights Reserved.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.