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WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Arrayopen access

Authors
Lee, JuheeKim, Yang WooJeon, SanggeunKim, Moonil
Issue Date
7월-2022
Publisher
MDPI
Keywords
terahertz waveguide module; spatial power combining; integrated waveguide transition
Citation
ELECTRONICS, v.11, no.13
Indexed
SCIE
SCOPUS
Journal Title
ELECTRONICS
Volume
11
Number
13
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/143875
DOI
10.3390/electronics11132091
ISSN
2079-9292
Abstract
The performance of WR-3.4 overmoded waveguide modules containing a linear array of discrete terahertz integrated circuits is presented to verify a new power-combining technique. Custom-designed thru-line IC chips that include back-to-back broadband antenna transitions were fabricated with an area of 390 x 750 mm(2) for waveguide packaging. Multiple array modules were assembled to verify the repeatability in performance. The array modules exhibited almost identical amounts of insertion losses compared with single-element modules, showing the best insertion loss of 2.6 dB over a 1 dB bandwidth of 95 GHz.
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공과대학 (전기전자공학부)
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