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Effect of Pd(P) layer on reflow reaction of submicron Au/Pd(P)/Ni(P) surface finish with Sn-Ag-(Cu) solders
Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Huh, Joo Youl | - |
| dc.date.accessioned | 2021-08-29T05:30:02Z | - |
| dc.date.available | 2021-08-29T05:30:02Z | - |
| dc.date.created | 2021-04-22 | - |
| dc.date.issued | 2014-11-18 | - |
| dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/36933 | - |
| dc.publisher | 대한금속 재료학회 | - |
| dc.title | Effect of Pd(P) layer on reflow reaction of submicron Au/Pd(P)/Ni(P) surface finish with Sn-Ag-(Cu) solders | - |
| dc.title.alternative | Effect of Pd(P) layer on reflow reaction of submicron Au/Pd(P)/Ni(P) surface finish with Sn-Ag-(Cu) solders | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | Huh, Joo Youl | - |
| dc.identifier.bibliographicCitation | 3rd Electronic Materials and Nanotechnology for Green Environment (ENGE 2014) | - |
| dc.relation.isPartOf | 3rd Electronic Materials and Nanotechnology for Green Environment (ENGE 2014) | - |
| dc.relation.isPartOf | ENGE 2014 초록집 | - |
| dc.citation.title | 3rd Electronic Materials and Nanotechnology for Green Environment (ENGE 2014) | - |
| dc.citation.conferencePlace | KO | - |
| dc.citation.conferencePlace | 제주 | - |
| dc.citation.conferenceDate | 2014-11-16 | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 2 | - |
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