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Application of Flatterning to Electrowetting on Dielectric Device Fabrication for Reliability Enhancement
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | CHUN, Honggu | - |
| dc.date.accessioned | 2021-08-29T17:32:10Z | - |
| dc.date.available | 2021-08-29T17:32:10Z | - |
| dc.date.created | 2021-04-22 | - |
| dc.date.issued | 2013-05-29 | - |
| dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/44160 | - |
| dc.publisher | The Korean Biochip Society | - |
| dc.title | Application of Flatterning to Electrowetting on Dielectric Device Fabrication for Reliability Enhancement | - |
| dc.title.alternative | Application of Flatterning to Electrowetting on Dielectric Device Fabrication for Reliability Enhancement | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | CHUN, Honggu | - |
| dc.identifier.bibliographicCitation | The Korean Biochip Society 2013 | - |
| dc.relation.isPartOf | The Korean Biochip Society 2013 | - |
| dc.relation.isPartOf | The Korean Biochip Society 2013 | - |
| dc.citation.title | The Korean Biochip Society 2013 | - |
| dc.citation.conferencePlace | KO | - |
| dc.citation.conferencePlace | 서울 | - |
| dc.citation.conferenceDate | 2013-05-29 | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 2 | - |
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