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Effect of plasma pretreatment on the direction in a chemical vapor deposition of copper using Cu(dmamb)2

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dc.contributor.authorBYUN, Dong Jin-
dc.date.accessioned2021-08-29T20:51:52Z-
dc.date.available2021-08-29T20:51:52Z-
dc.date.created2021-04-22-
dc.date.issued2011-12-07-
dc.identifier.urihttps://scholar.korea.ac.kr/handle/2021.sw.korea/46246-
dc.publisherThe Korea Physical Society-
dc.titleEffect of plasma pretreatment on the direction in a chemical vapor deposition of copper using Cu(dmamb)2-
dc.title.alternativeEffect of plasma pretreatment on the direction in a chemical vapor deposition of copper using Cu(dmamb)2-
dc.typeConference-
dc.contributor.affiliatedAuthorBYUN, Dong Jin-
dc.identifier.bibliographicCitationThe 7th International Conference on Advanced Materials and Devices-
dc.relation.isPartOfThe 7th International Conference on Advanced Materials and Devices-
dc.relation.isPartOfThe 7th International Conference on Advanced Materials and Devices-
dc.citation.titleThe 7th International Conference on Advanced Materials and Devices-
dc.citation.conferencePlaceKO-
dc.citation.conferenceDate2011-12-07-
dc.type.rimsCONF-
dc.description.journalClass1-
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