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Suppression of Cu migration by using biphenyl type epoxy

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dc.contributor.authorYoon, Ho Gyu-
dc.date.accessioned2021-08-29T21:33:34Z-
dc.date.available2021-08-29T21:33:34Z-
dc.date.created2021-04-22-
dc.date.issued2011-09-15-
dc.identifier.urihttps://scholar.korea.ac.kr/handle/2021.sw.korea/46585-
dc.publisher한국고분자학회, 대한화학회-
dc.titleSuppression of Cu migration by using biphenyl type epoxy-
dc.title.alternativeSuppression of Cu migration by using biphenyl type epoxy-
dc.typeConference-
dc.contributor.affiliatedAuthorYoon, Ho Gyu-
dc.identifier.bibliographicCitationKJF-ICOMEP 2011-
dc.relation.isPartOfKJF-ICOMEP 2011-
dc.relation.isPartOfKJF-ICOMEP 2011-
dc.citation.titleKJF-ICOMEP 2011-
dc.citation.conferencePlaceKO-
dc.citation.conferencePlace경주-
dc.citation.conferenceDate2011-09-15-
dc.type.rimsCONF-
dc.description.journalClass1-
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공과대학 (신소재공학부)
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