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6W/25mm2 Inductive Power Transfer for Non-Contact Wafer-Level Testing
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Hayun Cecillia Chung | - |
| dc.date.accessioned | 2021-08-29T21:54:08Z | - |
| dc.date.available | 2021-08-29T21:54:08Z | - |
| dc.date.created | 2021-04-22 | - |
| dc.date.issued | 2011-02-22 | - |
| dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/46892 | - |
| dc.publisher | IEEE | - |
| dc.title | 6W/25mm2 Inductive Power Transfer for Non-Contact Wafer-Level Testing | - |
| dc.title.alternative | 6W/25mm2 Inductive Power Transfer for Non-Contact Wafer-Level Testing | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | Hayun Cecillia Chung | - |
| dc.identifier.bibliographicCitation | IEEE International Solid-State Circuits Conference 2011 | - |
| dc.relation.isPartOf | IEEE International Solid-State Circuits Conference 2011 | - |
| dc.relation.isPartOf | Proceedings of ISSCC 2011 | - |
| dc.citation.title | IEEE International Solid-State Circuits Conference 2011 | - |
| dc.citation.conferencePlace | US | - |
| dc.citation.conferenceDate | 2011-02-20 | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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