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Effect of Post CMP cleaning on Electrochemical Characteristics of Cu
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Sung, Yun Mo | - |
| dc.date.accessioned | 2021-08-30T06:26:50Z | - |
| dc.date.available | 2021-08-30T06:26:50Z | - |
| dc.date.created | 2021-04-22 | - |
| dc.date.issued | 2009-04-15 | - |
| dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/51114 | - |
| dc.publisher | Materiasl Research Society (MRS) | - |
| dc.title | Effect of Post CMP cleaning on Electrochemical Characteristics of Cu | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | Sung, Yun Mo | - |
| dc.identifier.bibliographicCitation | 2009 Materiasl Research Society (MRS) Spring Meeting | - |
| dc.relation.isPartOf | 2009 Materiasl Research Society (MRS) Spring Meeting | - |
| dc.citation.title | 2009 Materiasl Research Society (MRS) Spring Meeting | - |
| dc.citation.conferencePlace | US | - |
| dc.citation.conferenceDate | 2009-04-13 | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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