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Re-precipitation of Cu6Sn5 onto Ni substrate during thermal aging of solder joints
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Huh, Joo Youl | - |
| dc.date.accessioned | 2021-08-30T08:56:02Z | - |
| dc.date.available | 2021-08-30T08:56:02Z | - |
| dc.date.created | 2021-04-22 | - |
| dc.date.issued | 2009-02-19 | - |
| dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/51730 | - |
| dc.publisher | TMS | - |
| dc.title | Re-precipitation of Cu6Sn5 onto Ni substrate during thermal aging of solder joints | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | Huh, Joo Youl | - |
| dc.identifier.bibliographicCitation | TMS 2009 Annual Meeting | - |
| dc.relation.isPartOf | TMS 2009 Annual Meeting | - |
| dc.citation.title | TMS 2009 Annual Meeting | - |
| dc.citation.conferencePlace | US | - |
| dc.citation.conferencePlace | San Francisco, CA | - |
| dc.citation.conferenceDate | 2009-02-15 | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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