Thermal Contact Conductance-Based Thermal Behavior Analytical Model for a Hybrid Floor at Elevated Temperatures
- Authors
- Park, Min Jae; Min, Jeong Ki; Bae, Jaehoon; Ju, Young K.
- Issue Date
- 10월-2020
- Publisher
- MDPI
- Keywords
- polymeric material; hybrid floor; thermal contact conductance; thermal behavior analytical model; fire resistance performance
- Citation
- MATERIALS, v.13, no.19
- Indexed
- SCIE
SCOPUS
- Journal Title
- MATERIALS
- Volume
- 13
- Number
- 19
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/53015
- DOI
- 10.3390/ma13194257
- ISSN
- 1996-1944
- Abstract
- Hybrid floors infilled with polymeric materials between two steel plates were developed as a prefabricated floor system in the construction industry. However, the floor's fire resistance performance has not been investigated. To evaluate this, fire tests suggested by the Korean Standards should be performed. As these tests are costly and time consuming, the number of variables were limited. However, many variables can be investigated in other ways such as furnace tests and finite element analysis (FEA) with less cost and time. In this study, furnace tests on heated surface areas smaller than 1 m(2) were conducted to investigate the thermal behavior of the hybrid floor at elevated temperatures. To obtain the reliability of the proposed thermal behavior analytical (TBA) model, verifications were conducted by FEAs. Thermal contact conductance including interfacial thermal properties between two materials was adopted in the TBA model, and the values at elevated temperatures were suggested based on thermo-gravimetric analyses results and verified by FEA. Errors between the tests and TBA model indicated that the model was adequate in predicting the temperature distribution in small-scale hybrids. Furthermore, larger furnace tests and analysis results were compared to verify the TBA model's application to different sized hybrid floors.
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Collections - College of Engineering > School of Civil, Environmental and Architectural Engineering > 1. Journal Articles
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