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Sn-0.3Ag-0.7Cu Solder의 신뢰성 평가에 관한 연구

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dc.contributor.authorYoon, Wooyoung-
dc.date.accessioned2021-08-31T15:29:16Z-
dc.date.available2021-08-31T15:29:16Z-
dc.date.created2021-04-22-
dc.date.issued2008-04-25-
dc.identifier.urihttps://scholar.korea.ac.kr/handle/2021.sw.korea/58676-
dc.publisher대한금속재료학회-
dc.subjectsolder, Pb-free, SMT-
dc.titleSn-0.3Ag-0.7Cu Solder의 신뢰성 평가에 관한 연구-
dc.typeConference-
dc.contributor.affiliatedAuthorYoon, Wooyoung-
dc.identifier.bibliographicCitation2008년도 대한 금속·재료학회 춘계학술대회-
dc.relation.isPartOf2008년도 대한 금속·재료학회 춘계학술대회-
dc.relation.isPartOf학술대회개요집-
dc.citation.title2008년도 대한 금속·재료학회 춘계학술대회-
dc.citation.conferencePlaceKO-
dc.citation.conferencePlace대전, 대전컨벤션센터-
dc.citation.conferenceDate2008-04-24-
dc.type.rimsCONF-
dc.description.journalClass2-
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