Via-Hole-Type Flip-Chip Packaging to Improve the Thermal Characteristics and Reliability of Blue Light Emitting Diodes
DC Field | Value | Language |
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dc.contributor.author | Kim, Ho Young | - |
dc.contributor.author | Lim, Chang Man | - |
dc.contributor.author | Kim, Ki Seok | - |
dc.contributor.author | Oh, Jeong Tak | - |
dc.contributor.author | Jeong, Hwan-Hee | - |
dc.contributor.author | Song, June-O | - |
dc.contributor.author | Seong, Tae-Yeon | - |
dc.contributor.author | Amano, Hiroshi | - |
dc.date.accessioned | 2021-09-01T08:30:42Z | - |
dc.date.available | 2021-09-01T08:30:42Z | - |
dc.date.created | 2021-06-19 | - |
dc.date.issued | 2019-08-22 | - |
dc.identifier.issn | 2162-8769 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/63487 | - |
dc.description.abstract | We investigated the effect of via-holes in the lead-frame on the reliability of blue flip-chip light-emitting diodes (FCLEDs). For bonding, conventional Sn-Ag(3.0%)-Cu(0.5%) solder (SAC) and Ag sintered paste were adopted. Lateral LED, conventional FCLED (c-FCLED), and via-hole FCLED gave efficacies of 218.5, 221.6 and 225 1m/W at 30 mA. The lateral LED sample (bonding material: silicone), c-FCLED sample (SAC), via-hole-type sample (Ag sinter), and via-hole-type sample (SAC) exhibited total thermal resistance of 15.24, 10.19, 8.95, and 11.79 K/W, respectively. The humidity/temperature/H2S gas reliability examinations showed that unlike the via-hole-type samples, the lumen of the c-FCLED was fallen by 15.0% after exposure for 500 h. Furthermore, the c-FCLED exhibited a 19.6% higher forward voltage than the via-hole FCLED after 1,000 thermal-cycles. SEM results showed that unlike the via-hole type FCLED, the c-FCLED underwent cracking after thermal cycle of 1000 times. (C) 2019 The Electrochemical Society. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | ELECTROCHEMICAL SOC INC | - |
dc.subject | HIGHLY REFLECTIVE ITO/DBR | - |
dc.subject | P-TYPE | - |
dc.subject | LEDS | - |
dc.subject | ENHANCEMENT | - |
dc.subject | RESISTANCE | - |
dc.subject | CONTACTS | - |
dc.subject | SILICON | - |
dc.subject | OUTPUT | - |
dc.subject | CU | - |
dc.title | Via-Hole-Type Flip-Chip Packaging to Improve the Thermal Characteristics and Reliability of Blue Light Emitting Diodes | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Seong, Tae-Yeon | - |
dc.identifier.doi | 10.1149/2.0171909jss | - |
dc.identifier.scopusid | 2-s2.0-85072663617 | - |
dc.identifier.wosid | 000482553000001 | - |
dc.identifier.bibliographicCitation | ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, v.8, no.9, pp.Q165 - Q170 | - |
dc.relation.isPartOf | ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY | - |
dc.citation.title | ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY | - |
dc.citation.volume | 8 | - |
dc.citation.number | 9 | - |
dc.citation.startPage | Q165 | - |
dc.citation.endPage | Q170 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | HIGHLY REFLECTIVE ITO/DBR | - |
dc.subject.keywordPlus | P-TYPE | - |
dc.subject.keywordPlus | LEDS | - |
dc.subject.keywordPlus | ENHANCEMENT | - |
dc.subject.keywordPlus | RESISTANCE | - |
dc.subject.keywordPlus | CONTACTS | - |
dc.subject.keywordPlus | SILICON | - |
dc.subject.keywordPlus | OUTPUT | - |
dc.subject.keywordPlus | CU | - |
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