Effect of the Properties of Uniformly Patterned Micro-Diamond Pellets on Sapphire Grinding

Abstract

If nanoscale roughness of machined surfaces is to be achieved, a machining method using a ductile grinding mode is required. If this using a diamond tool is to be realized, uniform patterned micro-diamond pellets must be produced on the tool surface. In this study, uniform patterned micro-diamond pellets were fabricated by using Lithographie Galvanoformung Abformung (LIGA) technology combined with electroplating technology. The effect of the size of the patterned diamond pellet on sapphire wafer grinding was analyzed using a scanning electron microscope and a surface profiler after grinding. As a result, O12 uniformly patterned micro-diamond pellets were fabricated, and a sapphire substrate was ground to obtain a surface roughness (Ra) of 5 nm or less.