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Thermal Modeling and Validation of a Real-World Mobile AP
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Gong, Young-Ho | - |
| dc.contributor.author | Yoo, Jae Jeong | - |
| dc.contributor.author | Chung, Sung Woo | - |
| dc.date.accessioned | 2021-09-02T17:01:59Z | - |
| dc.date.available | 2021-09-02T17:01:59Z | - |
| dc.date.created | 2021-06-16 | - |
| dc.date.issued | 2018-01 | - |
| dc.identifier.issn | 2168-2356 | - |
| dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/78441 | - |
| dc.language | English | - |
| dc.language.iso | en | - |
| dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
| dc.title | Thermal Modeling and Validation of a Real-World Mobile AP | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | Chung, Sung Woo | - |
| dc.identifier.doi | 10.1109/MDAT.2017.2695958 | - |
| dc.identifier.scopusid | 2-s2.0-85041894700 | - |
| dc.identifier.wosid | 000424635400009 | - |
| dc.identifier.bibliographicCitation | IEEE DESIGN & TEST, v.35, no.1, pp.55 - 62 | - |
| dc.relation.isPartOf | IEEE DESIGN & TEST | - |
| dc.citation.title | IEEE DESIGN & TEST | - |
| dc.citation.volume | 35 | - |
| dc.citation.number | 1 | - |
| dc.citation.startPage | 55 | - |
| dc.citation.endPage | 62 | - |
| dc.type.rims | ART | - |
| dc.type.docType | Article | - |
| dc.description.journalClass | 1 | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Computer Science | - |
| dc.relation.journalResearchArea | Engineering | - |
| dc.relation.journalWebOfScienceCategory | Computer Science, Hardware & Architecture | - |
| dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
| dc.subject.keywordAuthor | Mobile Application Processor | - |
| dc.subject.keywordAuthor | Package-on-Package | - |
| dc.subject.keywordAuthor | Temperature | - |
| dc.subject.keywordAuthor | Thermal Modeling | - |
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