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Transient electronics
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | SukWon Hwang | - |
| dc.date.accessioned | 2021-08-27T12:59:39Z | - |
| dc.date.available | 2021-08-27T12:59:39Z | - |
| dc.date.created | 2021-04-22 | - |
| dc.date.issued | 2019-11-14 | - |
| dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/8025 | - |
| dc.publisher | KMEPS | - |
| dc.title | Transient electronics | - |
| dc.title.alternative | Transient electronics | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | SukWon Hwang | - |
| dc.identifier.bibliographicCitation | ISMP-EMAP 2019, The 18th International Symposium on Microelectronics and Packaging, The 21st Electronic Materials and Packaging(EMAP) Conference | - |
| dc.relation.isPartOf | ISMP-EMAP 2019, The 18th International Symposium on Microelectronics and Packaging, The 21st Electronic Materials and Packaging(EMAP) Conference | - |
| dc.relation.isPartOf | electronic materials and packaging | - |
| dc.citation.title | ISMP-EMAP 2019, The 18th International Symposium on Microelectronics and Packaging, The 21st Electronic Materials and Packaging(EMAP) Conference | - |
| dc.citation.conferencePlace | KO | - |
| dc.citation.conferenceDate | 2019-11-13 | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 2 | - |
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