Effect of grain size on the electrical failure of copper contacts in fretting motion
- Authors
- Noh, H. J.; Kim, J. W.; Lee, S. M.; Jang, H.
- Issue Date
- 7월-2017
- Publisher
- ELSEVIER SCI LTD
- Keywords
- Grain size; Fretting wear; Fretting corrosion; Electrical contacts
- Citation
- TRIBOLOGY INTERNATIONAL, v.111, pp.39 - 45
- Indexed
- SCIE
SCOPUS
- Journal Title
- TRIBOLOGY INTERNATIONAL
- Volume
- 111
- Start Page
- 39
- End Page
- 45
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/83053
- DOI
- 10.1016/j.triboint.2017.02.043
- ISSN
- 0301-679X
- Abstract
- The influence of grain size on degradation of electrical contacts during fretting wear was investigated. Copper polycrystals with grain sizes of 2-162 mu m were used to examine friction, wear, and electrical contact resistance. The results showed that the electrical contact failure was caused by the compact oxide layer produced at the contact junction. Copper specimens with smaller grains had a longer lifecycle because of grain-size strengthening. However, this strengthening effect was limited to a critical grain size and, with further increase in grain size, plastic deformation underneath the contact surface played a major role in delaying the contact failure caused by oxide formation on the fretting surface.
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Collections - College of Engineering > Department of Materials Science and Engineering > 1. Journal Articles
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