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Magnetic Field Stability Analysis on No-Insulation and Turn-to-Turn Soldered HTS Magnets Under Sinusoidal Noise Operation

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dc.contributor.authorLee, Woo Seung-
dc.contributor.authorPark, Young Gun-
dc.contributor.authorKim, Jinsub-
dc.contributor.authorSong, Seunghyun-
dc.contributor.authorJeon, Haeryong-
dc.contributor.authorKim, Young-Gyun-
dc.contributor.authorLee, Haigun-
dc.contributor.authorKo, Tae Kuk-
dc.date.accessioned2021-09-03T23:25:19Z-
dc.date.available2021-09-03T23:25:19Z-
dc.date.created2021-06-18-
dc.date.issued2016-06-
dc.identifier.issn1051-8223-
dc.identifier.urihttps://scholar.korea.ac.kr/handle/2021.sw.korea/88518-
dc.description.abstractThe field stability of a no-insulation and a turn-to-turn soldered high-temperature superconducting (HTS) magnet is analyzed under sinusoidal noise operation. The stability of the magnetic field is a critical factor for some applications such as nuclear magnetic resonance (NMR) spectrometer. The no-insulation and turn-to-turn soldered HTS magnets have intrinsic residual resistance which acts like a low-pass filter attached to the main magnet. The intrinsic low-pass filter can improve the time stability of the magnetic field by reducing ac noises generated by the power supply. In this paper, the improved field stability is analyzed with a no-insulation and a turn-to-turn soldered HTS magnet sample. The sample magnets are operated under sinusoidal power supply noise. Qualitative analysis is conducted by simulating the virtual NMR lineshapes based on the field mapping results obtained during sample magnet operation. Both the no-insulation and turn-to-turn soldered magnets demonstrated improved field stability, but the field stability in the turn-to-turn soldered case is greater.-
dc.languageEnglish-
dc.language.isoen-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.titleMagnetic Field Stability Analysis on No-Insulation and Turn-to-Turn Soldered HTS Magnets Under Sinusoidal Noise Operation-
dc.typeArticle-
dc.contributor.affiliatedAuthorLee, Haigun-
dc.identifier.doi10.1109/TASC.2016.2516762-
dc.identifier.scopusid2-s2.0-84962450019-
dc.identifier.wosid000389656100001-
dc.identifier.bibliographicCitationIEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, v.26, no.4-
dc.relation.isPartOfIEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY-
dc.citation.titleIEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY-
dc.citation.volume26-
dc.citation.number4-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.subject.keywordAuthorField stability-
dc.subject.keywordAuthorlow-pass filter-
dc.subject.keywordAuthorNMR lineshape-
dc.subject.keywordAuthorno-insulation-
dc.subject.keywordAuthorturn-to-turn soldered-
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