Influence of Particle Velocity of Copper on Emitter Contact by Cold-Spray Method
DC Field | Value | Language |
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dc.contributor.author | Kang, Byungjun | - |
dc.contributor.author | Lee, Kyung Dong | - |
dc.contributor.author | Lee, Jong-gun | - |
dc.contributor.author | Choi, Jae-Wook | - |
dc.contributor.author | Yoon, Sam S. | - |
dc.contributor.author | Kang, Yoonmook | - |
dc.contributor.author | Lee, Hae-seok | - |
dc.contributor.author | Kim, Donghwan | - |
dc.date.accessioned | 2021-09-04T03:23:52Z | - |
dc.date.available | 2021-09-04T03:23:52Z | - |
dc.date.created | 2021-06-18 | - |
dc.date.issued | 2016-02 | - |
dc.identifier.issn | 1059-9630 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/89622 | - |
dc.description.abstract | In this study, we investigated cold-sprayed copper as a front contact for crystalline silicon solar cells. Copper powder was deposited on a monocrystalline silicon wafer with variation of the particle velocity during deposition. The particle velocity was varied by varying the heating temperature from 250 to 400 degrees C using a gas pressure of 0.45 MPa. The particle velocities were calculated using empirical equations, and were found to increase with an increase in the carrier gas temperature. Grid patterns were formed on a phosphorus-doped n-type emitter of a p-type silicon substrate. The electrode thickness increased with increasing particle velocity. The electrical properties of the grids were evaluated using the transfer length method. The specific contact resistance of the n-type emitter was in the range of 2.6-26.4 m Omega-cm(2). Damage to the p-n junction was investigated via minority carrier lifetime measurement of the substrate. The copper-silicon interface was evaluated using transmission electron microscopy. The contact properties were affected by the interface conditions. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | SPRINGER | - |
dc.subject | SOLAR-CELLS | - |
dc.subject | SUBSTRATE | - |
dc.title | Influence of Particle Velocity of Copper on Emitter Contact by Cold-Spray Method | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Yoon, Sam S. | - |
dc.contributor.affiliatedAuthor | Kang, Yoonmook | - |
dc.contributor.affiliatedAuthor | Lee, Hae-seok | - |
dc.contributor.affiliatedAuthor | Kim, Donghwan | - |
dc.identifier.doi | 10.1007/s11666-015-0349-5 | - |
dc.identifier.scopusid | 2-s2.0-84957427899 | - |
dc.identifier.wosid | 000374269200007 | - |
dc.identifier.bibliographicCitation | JOURNAL OF THERMAL SPRAY TECHNOLOGY, v.25, no.3, pp.465 - 472 | - |
dc.relation.isPartOf | JOURNAL OF THERMAL SPRAY TECHNOLOGY | - |
dc.citation.title | JOURNAL OF THERMAL SPRAY TECHNOLOGY | - |
dc.citation.volume | 25 | - |
dc.citation.number | 3 | - |
dc.citation.startPage | 465 | - |
dc.citation.endPage | 472 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Coatings & Films | - |
dc.subject.keywordPlus | SOLAR-CELLS | - |
dc.subject.keywordPlus | SUBSTRATE | - |
dc.subject.keywordAuthor | cold-spray | - |
dc.subject.keywordAuthor | contact resistance | - |
dc.subject.keywordAuthor | copper | - |
dc.subject.keywordAuthor | particle velocity | - |
dc.subject.keywordAuthor | phosphorus emitter | - |
dc.subject.keywordAuthor | solar cell | - |
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