A review: Comparison of fabrication and characteristics of flexible reram and multi-insulating graphene oxide layer reram
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, D.-K. | - |
dc.contributor.author | Kim, T. | - |
dc.contributor.author | Yoon, T. | - |
dc.contributor.author | Pak, J.J. | - |
dc.date.accessioned | 2021-09-04T08:54:23Z | - |
dc.date.available | 2021-09-04T08:54:23Z | - |
dc.date.created | 2021-06-17 | - |
dc.date.issued | 2016 | - |
dc.identifier.issn | 1975-8359 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/91414 | - |
dc.description.abstract | A rapid progress of the next-generation non-volatile memory device has been made in recent years. Metal/insulator/Metal multi-layer structure resistive RAM(ReRAM) has attracted a great deal of attention because it has advantages of simple fabrication, low cost, low power consumption, and low operating voltage. This paper describes the working principle of the ReRAM device, a review of fabrication techniques, and characteristics of flexible ReRAM devices using graphene oxide as an insulating layer and ReRAM devices using multi-layered insulator. The switching characteristics of the above ReRAM devices have been compared. The oxidized graphene could be employed as an insulator of next generation ReRAM devices. Copyright © The Korean Institute of Electrical Engineers. | - |
dc.language | Korean | - |
dc.language.iso | ko | - |
dc.publisher | Korean Institute of Electrical Engineers | - |
dc.subject | Data storage equipment | - |
dc.subject | Digital storage | - |
dc.subject | Fabrication | - |
dc.subject | Graphene | - |
dc.subject | Random access storage | - |
dc.subject | RRAM | - |
dc.subject | Fabrication technique | - |
dc.subject | Graphene oxides | - |
dc.subject | Low operating voltage | - |
dc.subject | Low-power consumption | - |
dc.subject | Nonvolatile memory devices | - |
dc.subject | RESET | - |
dc.subject | Resistive rams (ReRAM) | - |
dc.subject | Switching characteristics | - |
dc.subject | Graphene devices | - |
dc.title | A review: Comparison of fabrication and characteristics of flexible reram and multi-insulating graphene oxide layer reram | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Pak, J.J. | - |
dc.identifier.doi | 10.5370/KIEE.2016.65.8.1369 | - |
dc.identifier.scopusid | 2-s2.0-84988878707 | - |
dc.identifier.bibliographicCitation | Transactions of the Korean Institute of Electrical Engineers, v.65, no.8, pp.1369 - 1375 | - |
dc.relation.isPartOf | Transactions of the Korean Institute of Electrical Engineers | - |
dc.citation.title | Transactions of the Korean Institute of Electrical Engineers | - |
dc.citation.volume | 65 | - |
dc.citation.number | 8 | - |
dc.citation.startPage | 1369 | - |
dc.citation.endPage | 1375 | - |
dc.type.rims | ART | - |
dc.type.docType | Review | - |
dc.identifier.kciid | ART002132013 | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scopus | - |
dc.description.journalRegisteredClass | kci | - |
dc.subject.keywordPlus | Data storage equipment | - |
dc.subject.keywordPlus | Digital storage | - |
dc.subject.keywordPlus | Fabrication | - |
dc.subject.keywordPlus | Graphene | - |
dc.subject.keywordPlus | Random access storage | - |
dc.subject.keywordPlus | RRAM | - |
dc.subject.keywordPlus | Fabrication technique | - |
dc.subject.keywordPlus | Graphene oxides | - |
dc.subject.keywordPlus | Low operating voltage | - |
dc.subject.keywordPlus | Low-power consumption | - |
dc.subject.keywordPlus | Nonvolatile memory devices | - |
dc.subject.keywordPlus | RESET | - |
dc.subject.keywordPlus | Resistive rams (ReRAM) | - |
dc.subject.keywordPlus | Switching characteristics | - |
dc.subject.keywordPlus | Graphene devices | - |
dc.subject.keywordAuthor | Graphene oxide | - |
dc.subject.keywordAuthor | MIM | - |
dc.subject.keywordAuthor | ReRAM | - |
dc.subject.keywordAuthor | RESET | - |
dc.subject.keywordAuthor | SET | - |
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