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A 6-bit 2.5-GS/s Time-Interleaved Analog-to-Digital Converter Using Resistor-Array Sharing Digital-to-Analog Converter

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dc.contributor.authorLee, Hokyu-
dc.contributor.authorAurangozeb-
dc.contributor.authorPark, Sejin-
dc.contributor.authorKim, Jintae-
dc.contributor.authorKim, Chulwoo-
dc.date.accessioned2021-09-04T11:06:20Z-
dc.date.available2021-09-04T11:06:20Z-
dc.date.created2021-06-10-
dc.date.issued2015-11-
dc.identifier.issn1063-8210-
dc.identifier.urihttps://scholar.korea.ac.kr/handle/2021.sw.korea/92073-
dc.description.abstractThis paper presents a 6-bit 2.5-GS/s time-interleaved (TI) successive-approximation-register (SAR) analog-to-digital converter (ADC) that uses a resistor-array sharing digital-to-analog converter (RASD). By applying the input folding technique in the input stage and utilizing the flash-assisted TI-SAR ADC with the proposed RASD, the static power dissipation is reduced by 69%. ON-chip and OFF-chip calibration techniques are used to compensate the interchannel error sources. The prototype was fabricated in a 65-nm CMOS process technology. The peak integral nonlinearity and differential nonlinearity are measured as 0.52 and 0.51 LSB, respectively. At 2.5 GS/s, a signal-to-noise and distortion ratio (SNDR) of 18.6/31.9 dB and a spurious-free dynamic range (SFDR) of 23.7/42.1 dBc are measured before and after the calibration at the Nyquist input frequency with 1 Vpp-diff input signal, and the figure of merit is 0.27 pJ/conversion-step. This chip consumes 22 mW at 1.2-V supply and occupies 0.27-mm(2) area.-
dc.languageEnglish-
dc.language.isoen-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.subjectFLASH-ADC-
dc.subjectCMOS ADC-
dc.subjectSAR ADC-
dc.subjectCALIBRATION-
dc.subjectSIGNAL-
dc.subjectFIT-
dc.titleA 6-bit 2.5-GS/s Time-Interleaved Analog-to-Digital Converter Using Resistor-Array Sharing Digital-to-Analog Converter-
dc.typeArticle-
dc.contributor.affiliatedAuthorKim, Chulwoo-
dc.identifier.doi10.1109/TVLSI.2014.2372033-
dc.identifier.scopusid2-s2.0-84914820690-
dc.identifier.wosid000364209000002-
dc.identifier.bibliographicCitationIEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, v.23, no.11, pp.2371 - 2383-
dc.relation.isPartOfIEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS-
dc.citation.titleIEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS-
dc.citation.volume23-
dc.citation.number11-
dc.citation.startPage2371-
dc.citation.endPage2383-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaComputer Science-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalWebOfScienceCategoryComputer Science, Hardware & Architecture-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.subject.keywordPlusFLASH-ADC-
dc.subject.keywordPlusCMOS ADC-
dc.subject.keywordPlusSAR ADC-
dc.subject.keywordPlusCALIBRATION-
dc.subject.keywordPlusSIGNAL-
dc.subject.keywordPlusFIT-
dc.subject.keywordAuthorAnalog-to-digital converter (ADC)-
dc.subject.keywordAuthorcalibration-
dc.subject.keywordAuthorinput folding-
dc.subject.keywordAuthorresistive digital-to-analog converter (RDAC)-
dc.subject.keywordAuthorsuccessive approximation register (SAR)-
dc.subject.keywordAuthortime-interleaving (TI)-
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