Thermal Quench Behaviors of No-Insulation Coils Wound Using GdBCO Coated Conductor Tapes With Various Lamination Materials
DC Field | Value | Language |
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dc.contributor.author | Choi, Yoon Hyuck | - |
dc.contributor.author | Kwon, Oh Jun | - |
dc.contributor.author | Kim, Young-Gyun | - |
dc.contributor.author | Song, Jung-Bin | - |
dc.contributor.author | Kim, Ji Hyung | - |
dc.contributor.author | Kim, Ho-Min | - |
dc.contributor.author | Lee, Haigun | - |
dc.date.accessioned | 2021-09-05T08:17:40Z | - |
dc.date.available | 2021-09-05T08:17:40Z | - |
dc.date.created | 2021-06-15 | - |
dc.date.issued | 2014-06 | - |
dc.identifier.issn | 1051-8223 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/98330 | - |
dc.description.abstract | This paper presents the quench initiation and propagation characteristics of no-insulation racetrack coils wound using three types of Cu-stabilized CdBCO coated conductors (CCs), with SUS and brass laminations, and without lamination. The test results show that the minimum quench energy values of the brass-laminated CdBCO CC coil were larger than those of the SUS-laminated one. Moreover, the normal zone propagation velocities of the brass-laminated GdBCO CC coil were greater than those of the SUS-laminated one due to the higher thermal conductivity of brass. Moreover, the nonlaminated CdBCO CC coil exhibited greatly improved thermal stability compared to the brass/SUS-laminated GdBCO CC coils, because the local heat in the event of quenching was easily dissipated due to the absence of lamination. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.subject | NORMAL-ZONE PROPAGATION | - |
dc.title | Thermal Quench Behaviors of No-Insulation Coils Wound Using GdBCO Coated Conductor Tapes With Various Lamination Materials | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Lee, Haigun | - |
dc.identifier.doi | 10.1109/TASC.2013.2282501 | - |
dc.identifier.scopusid | 2-s2.0-84885143993 | - |
dc.identifier.wosid | 000332518500393 | - |
dc.identifier.bibliographicCitation | IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, v.24, no.3 | - |
dc.relation.isPartOf | IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY | - |
dc.citation.title | IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY | - |
dc.citation.volume | 24 | - |
dc.citation.number | 3 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | NORMAL-ZONE PROPAGATION | - |
dc.subject.keywordAuthor | Lamination | - |
dc.subject.keywordAuthor | minimum quench energy (MQE) | - |
dc.subject.keywordAuthor | no-insulation (NI) | - |
dc.subject.keywordAuthor | normal zone propagation velocity (NZPV) | - |
dc.subject.keywordAuthor | thermal stability | - |
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