셀 레벨에서의 OPTICS 기반 특질 추출을 이용한 칩 품질 예측A Prediction of Chip Quality using OPTICS (Ordering Points to Identify the Clustering Structure)-based Feature Extraction at the Cell Level
- Other Titles
- A Prediction of Chip Quality using OPTICS (Ordering Points to Identify the Clustering Structure)-based Feature Extraction at the Cell Level
- Authors
- 김기현; 백준걸
- Issue Date
- 2014
- Publisher
- 대한산업공학회
- Keywords
- Cell Defect; Cell Level; Feature Extraction; OPTICS; Quality Prediction
- Citation
- 대한산업공학회지, v.40, no.3, pp.257 - 266
- Indexed
- KCI
- Journal Title
- 대한산업공학회지
- Volume
- 40
- Number
- 3
- Start Page
- 257
- End Page
- 266
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/99954
- DOI
- 10.7232/JKIIE.2014.40.3.257
- ISSN
- 1225-0988
- Abstract
- The semiconductor manufacturing industry is managed by a number of parameters from the FAB which is the initial step of production to package test which is the final step of production. Various methods for prediction for the quality and yield are required to reduce the production costs caused by a complicated manufacturing process. In order to increase the accuracy of quality prediction, we have to extract the significant features from the large amount of data. In this study, we propose the method for extracting feature from the cell level data of probe test process using OPTICS which is one of the density-based clustering to improve the prediction accuracy of the quality of the assembled chips that will be placed in a package test. Two features extracted by using OPTICS are used as input variables of quality prediction model because of having position information of the cell defect. The package test progress for chips classified to the correct quality grade by performing the improved predictionmethod is expected to bring the effect of reducing production costs.
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Collections - College of Engineering > School of Industrial and Management Engineering > 1. Journal Articles
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