Differential-To-Common-Mode Conversion Suppression Using Mushroom Structure on Bent Differential Transmission Lines

  • Lee, Seungjin
  • Lim, Jaehyuk
  • Oh, Sangyeol
  • Kim, Yonghoon
  • Oh, Dan
  • ... Lee, Jaehoon
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초록

In this paper, we propose a method to suppress differential-to-common-mode conversion noise from right-angle bent differential lines by installing a mushroom structure on the narrow inner line. We assessed the mode conversion noise suppression characteristics of the proposed structure by analyzing dispersion diagrams. The proposed structure exhibits differentialto-common-mode conversion (S-cd21) below -20 dB up to 6 GHz, while S-cd21 of conventional right-angle bent differential lines is only maintained below -20 dB for frequencies up to 1.04 GHz. In addition, we suggest that further enhancements of the mode conversion suppression bandwidth can he achieved by installing multiple distributed mushroom structures on right-angle bent differential lines. The use of multiple distributed mushrooms enabled us to achieve a wider frequency bandwidth by compensating more fully for the phase difference between the inner and outer lines. Therefore, the right-angle bent differential lines with multiple distributed mushrooms can suppress mode conversion noise under -20 dB up to 10 GHz. We assessed the performance of our proposed structure by conducting measurements in both the frequency and time domains. We obtained a good agreement between our experimental and numerical results. In addition, we measured eye diagrams to demonstrate that the proposed structures suppress differential-to-common-mode conversion noise without degrading the differential signaling quality.

키워드

Bend discontinuitycommon-mode noisedifferential signalingdifferential-to-common-mode conversion noisemushroom structureright-angle bent differential linesNOISE SUPPRESSIONMICROSTRIP LINESREDUCTIONFILTERDISCONTINUITIES
제목
Differential-To-Common-Mode Conversion Suppression Using Mushroom Structure on Bent Differential Transmission Lines
저자
Lee, SeungjinLim, JaehyukOh, SangyeolKim, YonghoonOh, DanLee, Jaehoon
DOI
10.1109/TCPMT.2019.2895310
발행일
2019-04
유형
Article
저널명
IEEE Transactions on Components, Packaging and Manufacturing Technology
9
4
페이지
702 ~ 711