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Investigation of Minimum Tolerable Bending Strain of High-Temperature Superconductor Solder Joint by Varying the Thickness of the Stabilizer and Solder
Investigation of Minimum Tolerable Bending Strain of High-Temperature Superconductor Solder Joint by Varying the Thickness of the Stabilizer and Solder
- 제목
- Investigation of Minimum Tolerable Bending Strain of High-Temperature Superconductor Solder Joint by Varying the Thickness of the Stabilizer and Solder
- 제목 (타언어)
- Investigation of Minimum Tolerable Bending Strain of High-Temperature Superconductor Solder Joint by Varying the Thickness of the Stabilizer and Solder
- 저자
- Lee, Haigun
- 발행일
- 2023-09-13
- 학회명
- International Conference on Magnet Technology (MT28)
- 개최지
- Aix-en-Provence, France
- 개최국가
- 프랑스
- 학회 개최일
- 2023-09-10 ~ 2023-09-15