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Effect of Cu-containing solders on the critical IMC thickness for the shear strength of BGA solder joints
- 제목
- Effect of Cu-containing solders on the critical IMC thickness for the shear strength of BGA solder joints
- 저자
- Huh, Joo Youl
- 학회명
- IEEE/CPMT/ED
- 개최국가
- 싱가포르
- 학회 개최일
- 2000-12-05 ~ 2000-12-07