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Characteristics of Amorphous Tungsten Nitride Diffusion Barrier for Metal-Organic Chemical Vapor deposited Cu Metallization
Kim Yong Tae
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Characteristics of Amorphous Tungsten Nitride Diffusion Barrier for Metal-Organic Chemical Vapor deposited Cu Metallization
저자
Kim Yong Tae
발행일
1994-07-01
학회명
1994 Int'l Electron Devices and Materials Symp
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