Reducing the dielectric constant and loss of poly(aryl ether ketone)s via organic–inorganic hybrid crosslinking

초록

The demand for high-performance electronic devices operating at high frequencies requires substrate materials with a low dielectric constant and dielectric loss that show good mechanical and thermal stability. Composite polymer films were synthesized in this study; a self-crosslinkable diallyl-functionalized poly(aryl ether ketone) (PAEK) was used to reduce the dielectric loss, and octavinyl–polyhedral oligomeric silsesquioxane (octavinyl–POSS) was introduced as a multifunctional crosslinking agent to decrease the dielectric constant further. The crosslinking density was systematically controlled by adjusting the allyl monomer fraction and octavinyl–POSS content. The optimized composite film, labeled DA30–CH70–P5%, exhibits excellent dielectric performance with a dielectric constant of 2.60 and dielectric loss of 0.0028 at 10 GHz. In addition, the formation of an organic–inorganic crosslinked network significantly enhances the mechanical and thermal properties of the composite film, leading to a 34% increase in elastic modulus (from 0.961 to 1.296 GPa) and a 21 °C increase in glass transition temperature (from 155.4 to 176.3 °C) compared to the non-crosslinked PAEK. These results demonstrate that controlled self-crosslinking using diallyl-functionalized PAEK and octavinyl–POSS is an effective strategy for simultaneously enhancing the dielectric, mechanical, and thermal performance of low-dielectric constant (low-k) polymer systems. © 2026 Elsevier B.V.

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