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Effects of Process Parameters on the Adhesion of Copper Film on Polyethylene Tetrephthalate(PET) Substrate Prepared by ECRMOCVD Coupled with a Periodic DC Bias
- 제목
- Effects of Process Parameters on the Adhesion of Copper Film on Polyethylene Tetrephthalate(PET) Substrate Prepared by ECRMOCVD Coupled with a Periodic DC Bias
- 저자
- BYUN, Dong Jin
- 학회명
- 2003 MRS Fall Meeting Proceedings
- 개최지
- Boston, U.S.A
- 학회 개최일
- 2003-12-01 ~ 2003-12-05