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Enhanced Growth Kinetics of Intermetallic Compounds between Bi-Containing Sn-3.5Ag Solders and Cu Substrate during Aging
- 제목
- Enhanced Growth Kinetics of Intermetallic Compounds between Bi-Containing Sn-3.5Ag Solders and Cu Substrate during Aging
- 저자
- Huh, Joo Youl
- 발행일
- 2004-11-04
- 학회명
- Pacific Rim International Conference on Advanced Materials and Processing
- 개최국가
- 중국
- 학회 개최일
- 2004-11-02 ~ 2004-11-05