ScholarWorks@고려대학교

상세 보기

RF-MEMS package with vertical via hole for low loss characteristics

제목
RF-MEMS package with vertical via hole for low loss characteristics
저자
Ju, Byeongkwon
학회명
International Sensor Conference’2001
학회 개최일
2001-10-11 ~ 2001-10-13

ScholarWorks@고려대학교

02841 서울특별시 성북구 안암로 145 Tel. 02-3290-2963

COPYRIGHT © 고려대학교 All Rights Reserved.

Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.

You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.