Investigation of curing kinetics of various cycloaliphatic epoxy resins using dynamic thermal analysis

  • Yoo, Myong Jae
  • Kim, Sang Hyun
  • Park, Seong Dae
  • Lee, Woo Sung
  • Sun, Jong-Woo
  • 외 2명
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초록

Curing reactions of three cycloaliphatic epoxy resins with methyltetrahydrophthalic anhydride (MTHPA) was investigated by differential scanning calorimetry at different heating rates. Activation energy was calculated based on Kissinger method and varied in the range of 67-72 kJ/mol depending on sample. The curing kinetic behavior was well described by Sestak-Berggren (SB) model and the order of the curing reaction is observed to be from 0.02 to 2.11 according to sample. (C) 2010 Elsevier Ltd. All rights reserved.

키워드

Cure kineticsCycloaliphatic epoxy resinDifferential scanning calorimetryActivation energyDIFFERENTIAL SCANNING CALORIMETRYANHYDRIDE SYSTEMCURE KINETICSCROSS-LINKING
제목
Investigation of curing kinetics of various cycloaliphatic epoxy resins using dynamic thermal analysis
저자
Yoo, Myong JaeKim, Sang HyunPark, Seong DaeLee, Woo SungSun, Jong-WooChoi, Jae-HongNahm, Sahn
DOI
10.1016/j.eurpolymj.2010.02.001
발행일
2010-05
유형
Article
저널명
European Polymer Journal
46
5
페이지
1158 ~ 1162