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Overcoming Wire Loop Height Limitations in Ultra-Thin Packages through Edge-Insulated Epoxy Coating Technology
Overcoming Wire Loop Height Limitations in Ultra-Thin Packages through Edge-Insulated Epoxy Coating Technology
- 제목
- Overcoming Wire Loop Height Limitations in Ultra-Thin Packages through Edge-Insulated Epoxy Coating Technology
- 제목 (타언어)
- Overcoming Wire Loop Height Limitations in Ultra-Thin Packages through Edge-Insulated Epoxy Coating Technology
- 저자
- LEE Jae Woo
- 발행일
- 2026-01-30
- 학회명
- 제33회 한국반도체학술대회
- 개최국가
- 대한민국
- 학회 개최일
- 2026-01-27 ~ 2026-01-30